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Volumn , Issue , 2001, Pages 178-182
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A dry migration? Copper dendrite growth in adhesive tape during burn-in
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CMOS INTEGRATED CIRCUITS;
COMPUTER SIMULATION;
COPPER;
CURVE FITTING;
ELECTRIC POTENTIAL;
ELECTRIC TAPES;
ELECTROCHEMISTRY;
ELECTROMIGRATION;
FAILURE ANALYSIS;
INTEGRATED CIRCUIT TESTING;
METALLIZING;
SEMICONDUCTOR DEVICE MANUFACTURE;
ADHESIVE TAPES;
COPPER DENDRITE GROWTH;
DRY MIGRATION;
DYNAMIC OPERATIONAL LIFE TEST;
ELECTROCHEMICAL MIGRATION;
PARALLEL LAPPING TECHNIQUE;
POLYAMIC ACID;
CHIP SCALE PACKAGES;
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EID: 0034825829
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (8)
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References (7)
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