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Volumn 40, Issue 1, 2011, Pages 35-41
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Microstructure, electrical properties, and electrochemical migration of a directly printed ag pattern
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Author keywords
Ag nanopaste; electrical resistivity; electrochemical migration; screen printing; silicon substrate; sintering
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Indexed keywords
AG ELECTRODE;
AG FILMS;
AG NANOPASTE;
CLUSTER SIZES;
ELECTRICAL CHARACTERISTIC;
ELECTRICAL PROPERTY;
ELECTRICAL RESISTIVITY;
ELECTROCHEMICAL MIGRATION;
HIGH TEMPERATURE;
SCREEN PRINTING METHODS;
SI SUBSTRATES;
SILICON SUBSTRATE;
SILICON SUBSTRATES;
SINTERING CONDITION;
SINTERING PROCESS;
SINTERING TEMPERATURES;
ELECTRIC CONDUCTIVITY;
ELECTROCHEMICAL PROPERTIES;
MICROSTRUCTURE;
PRINTING PRESSES;
SCREEN PRINTING;
SILVER;
SUBSTRATES;
SINTERING;
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EID: 78650736677
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-010-1408-9 Document Type: Article |
Times cited : (34)
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References (13)
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