SCOPUS 정보 검색 플랫폼

Volumn 290, Issue , 2014, Pages 433-439

Compressive elastic moduli and polishing performance of non-rigid core/shell structured PS/SiO 2 composite abrasives evaluated by AFM

(3) Chen, Ailian a Mu, Weibin a Chen, Yang a

a CHANGZHOU UNIVERSITY (China)

Author keywords

Chemical mechanical polishing; Compressive Young's modulus; Core shell composite microspheres

Indexed keywords

ABRASIVES; ATOMIC FORCE MICROSCOPY; DEFORMATION; ELASTIC MODULI; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MICROSPHERES; POLISHING; SILICA NANOPARTICLES; SILICON OXIDES; SILICON WAFERS; STABILITY; TRANSMISSION ELECTRON MICROSCOPY;

CHEMICAL MECHANICAL POLISHING(CMP); COMPOSITE MICROSPHERES; COMPRESSIVE ELASTIC MODULUS; HERTZIAN CONTACT MECHANICS; MATERIAL REMOVAL PROCESS; MATERIAL REMOVAL RATE; ROOT MEAN SQUARE ROUGHNESS; STRUCTURAL STABILITIES;

CHEMICAL MECHANICAL POLISHING;

EID: 84890987494 PISSN: 01694332 EISSN: None Source Type: Journal
DOI: 10.1016/j.apsusc.2013.11.100 Document Type: Article

Times cited : (43)

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