Copper CMP with composite polymer core-silica shell abrasives: A defectivity study

Journal of the Electrochemical Society

Volumn 156, Issue 1, 2009, Pages

  Armini, S ^a,b   Whelan, C M ^a   Moinpour, M ^c   Maex, K ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ABS RESINS; AGENTS; CARBON FIBER REINFORCED PLASTICS; COPPER; COUPLING AGENTS; GRINDING (MACHINING); LEAD; METAL RECOVERY; NANOTECHNOLOGY; OXIDES; PHOTORESISTS; POLYMERS; SHELLS (STRUCTURES); SILANES; SILICA; SURFACE ACTIVE AGENTS; SURFACE MORPHOLOGY; SURFACES;

APPLIED LOADS; BENZOTRIAZOLE; COLLOIDAL SILICAS; COMPLEXING AGENTS; COMPOSITE ABRASIVES; COMPOSITE POLYMERS; COPPER CHEMICAL MECHANICAL PLANARIZATION; COPPER CMP; DEFECTIVITY; ELECTROSTATIC ATTRACTIONS; ETCH RATES; INORGANIC MATERIALS; MATERIAL REMOVAL RATES; NON UNIFORMITIES; OXIDIZER CONCENTRATIONS; PARTICLE STABILIZATIONS; PEROXIDE CONCENTRATIONS; PURE POLYMERS; REMOVAL RATES; RMS ROUGHNESSES; SILANE COUPLING AGENTS; SILICA SHELLS; SLURRY CHEMISTRIES; SURFACE FINISHES; WAFER SURFACES;

POLYMER MATRIX COMPOSITES;

EID: 56749152005     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2994631     Document Type: Article

References (39)

1. H.-C. Chen, T.-C. Tsai, Y.-M. Huang, C.-H. Huang, C.-H. Chen, Y.-T. Wei, M.-S. Yang, J.-Y. Wu, T.-R. Yew, and J.-K. Chen, in Proceedings of the IEEE 2001 International Interconnect Technology Conference., p. 21 (2001).
2. S. Armini, C. M. Whelan, M. Smet, S. Eslava, and K. Maex, Polym. J., 38, 786 (2006).
3. S. Armini, C. M. Whelan, K. Maex, J. L. Hernandez, and M. Moinpour, J. Electrochem. Soc., 154, H667 (2007).
4. S. Aksu and F. M. Doyle, J. Electrochem. Soc., 149, G352 (2002).
5. S. Deshpande, S. C. Kuiry, M. Klimov, Y. Obeng, and S. Seal, J. Electrochem. Soc., 151, G788 (2004).
6. M. Hariharaputhiran, J. Zhang, S. Ramarajan, J. J. Keleher, Y. Li, and S. V. Babu, J. Electrochem. Soc., 147, 3820 (2000).
7. Z. Li, K. Ina, I. Koshiyama, and A. Philipossian, J. Electrochem. Soc., 152, G299 (2005).
8. P. B. Zantye, A. Kumar, and A. K. Sikder, Mater. Sci. Eng., R., 45, 89 (2004).
9. P. Wrschka, J. Hernandez, Y. Hsu, T. S. Kuan, G. S. Oehrlein, H. J. Sun, D. A. Hansen, J. King, and M. A. Fury, J. Electrochem. Soc., 146, 2689 (1999).
10. N. J. Brown, P. C. Baker, and R. T. Maney, Proc. SPIE, 306, 42 (1981).
11. F. Zhang and A. Busnaina, Electrochem. Solid-State Lett., 1, 184 (1998).
12. F. Zhang, A. Busnaina, and G. Ahmadi, J. Electrochem. Soc., 146, 2665 (1999).
13. G. Ahmadi and X. Xia, J. Electrochem. Soc., 148, G99 (2001).
14. R. Mazaheri and G. Ahmadi, J. Electrochem. Soc., 149, G370 (2002).
15. R. Mazaheri and G. Ahmadi, J. Electrochem. Soc., 150, G233 (2003).
16. J. Luo and D. A. Dornfeld, IEEE Trans. Semicond. Manuf., 16, 45 (2003).
17. U.S. Pat. 6,918,820.
18. N. Kawahashi and M. Hattori, Mater. Res. Soc. Symp. Proc., 671, M2.2.1 (2001).
19. K. Nishimoto, M. Hattori, and N. Kawahashi, Eur. Pat. EP1243611.
20. S. Armini, S. Eslava, C. M. Whelan, V. Terzieva, and K. Maex, in Proceedings of the American Chemical Society Colloid and Surface Science Symposium, 12-15, June 2005, Potsdam, New York, (2005).
21. S. Armini, I. U. Vakarelski, C. M. Whelan, K. Maex, and K. Higashitani, Langmuir, 23, 2007 (2007).
22. S. Armini, R. Burtovyy, I. Luzinov, C. M. Whelan, K. Maex, and M. Moinpour, Electrochem. Solid-State Lett., 10, H74 (2007).
23. I. Horcas, R. Fernandez, J. M. Gomez-Rodriguez, J. Colchero, J. Gomez-Herrero, and A. M. Baro, Rev. Sci. Instrum., 78, 013705 (2007).
24. M. Harihaputhiran, S. Ramarajan, and S. V. Babu, Mater. Res. Soc. Symp. Proc., 566, 129 (1999).
25. J. M. Steigerwald, S. P. Murarka, and R. J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, New York (1997).
26. P. W. Schindler, Adv. Chem. Ser., 67, 196 (1967).
27. C. W. Kaanta, S. G. Bombardier, W. J. Cote, W. R. Hill, G. Kerszykowski, H. S. Landis, D. J. Poindexer, C. W. Pollard, G. H. Ross, J. G. Ryan, in Proceedings of the 8th International VLSI Multilevel Interconnection Conference, p. 226 VMIC (1992).
28. S. V. Babu, Y. Li, M. Hariharaputhiran, S. Ramarajan, J. Zhang, Y.-S. Her, and J. E. Prendergast, in Proceedings of the 15th International VLSI Multilevel Interconnection Conference, p. 443 VMIC (1998).
29. D. Zeidler, Z. Stavreva, M. Plotner, and. K. Dresker, Microelectron. Eng., 33, 259 (1997).
30. L. Zhang and R. Shankar Subramanian, Thin Solid Films, 397, 143 (2001).
31. J. Lu, J. E. Garland, C. M. Pettit, S. V. Babu, and D. Roy, J. Electrochem. Soc., 151, G717 (2004).
32. U. Patri, S. Aksu, and S. V. Babu, J. Electrochem. Soc., 153, G650 (2006).
33. S. Aksu and F. M. Doyle, J. Electrochem. Soc., 148, B51 (2001).
34. T. Notoya and G. W. Poling, Corrosion (Houston), 35, 193 (1979).
35. Z. Lu, S.-H. Lee, S. V. Babu, and E. Matijevic, J. Colloid Interface Sci., 261, 55 (2003).
36. N. J. Brown, P. C. Baker, and R. T. Maney, Proc. SPIE, 306, 42 (1981).
37. U. Mahajan, M. Bielmann, and R. K. Singh, Mater. Res. Soc. Symp. Proc., 566, 27 (2000).
38. A. Jindal, S. Hegde, and S. V. Babu, Electrochem. Solid-State Lett., 5, G48 (2002).
39. S. Armini, C. M. Whelan, M. Moinpour, and K. Maex, Electrochem. Solid-State Lett., 11, H280 (2008).