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Applied Surface Science

Volumn 257, Issue 20, 2011, Pages 8679-8685

Polishing behavior of PS/CeO 2 hybrid microspheres with controlled shell thickness on silicon dioxide CMP

(2) Chen, Yang a Long, Renwei a

a CHANGZHOU UNIVERSITY (China)

Author keywords

Chemical mechanical polishing (CMP); Core shell structure; Shell thickness

Indexed keywords

ABRASIVES; ATOMIC FORCE MICROSCOPY; CERIUM OXIDE; EMULSIFICATION; EMULSION POLYMERIZATION; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MICROSPHERES; NANOPARTICLES; POLISHING; SHELLS (STRUCTURES); SILICA; SYNTHESIS (CHEMICAL); THERMOGRAVIMETRIC ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

CHEMICAL MECHANICAL POLISHING(CMP); COMPOSITE MICROSPHERES; CORE SHELL STRUCTURE; DECOMPOSITION REACTION; ORGANIC-INORGANIC COMPOSITE; POSSIBLE MECHANISMS; SHELL THICKNESS; SOAP-FREE EMULSION POLYMERIZATION;

CHEMICAL MECHANICAL POLISHING;

EID: 79959364961 PISSN: 01694332 EISSN: None Source Type: Journal
DOI: 10.1016/j.apsusc.2011.05.047 Document Type: Article

Times cited : (84)

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