Silicon micropin-fin heat sink with integrated TSVs for 3-D ICs: Tradeoff analysis and experimental testing

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 3, Issue 11, 2013, Pages 1842-1850

  Zhang, Yue ^a   Dembla, Ashish ^a   Bakir, Muhannad S ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

3 D IC; Electrical thermal co design of heat sink; Microchannel heat sink (MFHS); Micropin fin heat sink (MPFHS); Through silicon via (TSV)

Indexed keywords

AIR-COOLED HEAT SINKS; CHIP JUNCTION TEMPERATURES; CO-DESIGNS; EXPERIMENTAL TESTING; MICRO CHANNEL HEAT SINKS; MICRO-PIN-FIN HEAT SINKS; MICROFLUIDIC COOLING; THROUGH-SILICON VIA;

ASPECT RATIO; FINS (HEAT EXCHANGE); INTEGRATED CIRCUITS; SILICON WAFERS;

MICROFLUIDICS;

EID: 84887935528     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2267492     Document Type: Article

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