Analysis and optimization of the thermal performance of microchannel heat sinks

International Journal of Numerical Methods for Heat and Fluid Flow

Volumn 15, Issue 1, 2005, Pages 7-26

  Liu, Dong ^a   Garimella, Suresh V ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Convection; Heat transfer; Optimization techniques

Indexed keywords

ALUMINUM; BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; COPPER; FRICTION; HEAT CONVECTION; HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER COEFFICIENTS; MATHEMATICAL MODELS; OPTIMIZATION; SPECIFIC HEAT; THERMAL CONDUCTIVITY;

FRICTION CONSTANTS; MASS FLOW RATES; MICROCHANNELS; OPTIMIZATION TECHNIQUES;

HEAT SINKS;

CHANNEL FLOW; HEAT; PERFORMANCE; THERMAL ANALYSIS;

EID: 13844280952     PISSN: 09615539     EISSN: None     Source Type: Journal    
DOI: 10.1108/09615530510571921     Document Type: Article

References (16)

1. Fedorov, A.G. and Viskanta, R. (2000), "Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging", International Journal of Heat and Mass Transfer, Vol. 43, pp. 399-415.
2. Fluent Inc. (1998), Fluent User's Guide, Lebanon, New Hampshire.
3. Harms, T.M., Kazmierczak, M.J. and Gerner, F.M. (1999), "Developing convective heat transfer in deep rectangular microchannels", International Journal of Heat and Fluid Flow, Vol. 20, pp. 149-57.
4. Incropera, F.P. and DeWitt, D.P. (1996), Fundamentals of Heat and Mass Transfer, Wiley, New York, NY.
5. Kim, S.J. and Kim, D. (1999), "Forced convection in microstructure for electronic equipment cooling" Journal of Heat Transfer, Vol. 121, pp. 639-45.
6. The MathWorks, Inc. (2001), Matlab, Version 6.1, Natwick, MA.
7. Ryu, J.H., Choi, D.H. and Kim, S.J. (2002), "Numerical optimization of the thermal performance of a microchannel heat sink", International Journal of Heat and Mass Transfer, Vol. 45, pp. 2823-7.
8. Sabry, M-N. (2001), "Transverse temperature gradient effect on fin efficiency for microchannel design", Journal of Electronic Packaging, Vol. 123, pp. 344-50.
9. Samalam, V.K. (1989), "Convective heat transfer in microchannels'', Journal of Electronic Materials, Vol. 18, pp. 6111-7.
10. Shah, R.K. and London, A.L. (1978), "Laminar flow forced convection in ducts", Advances in Heat Transfer, Supplement 1, Academic Press, London.
11. Sobhan, C.B. and Garimella, S.V. (2001), "A comparative analysis of studies on heat transfer and fluid flow in microchannels", Microscale Thermophysical Engineering, Vol. 5, pp. 293-311.
12. Toh, K.C., Chen, X.Y. and Chai, J.C. (2002), "Numerical computation of fluid flow and heat transfer in microchannels", International Journal of Heat and Mass Transfer, Vol. 45, pp. 5133-41.
13. Tuckerman, D.B. and Pease, R.F. (1981), "High-performance heat sinking for VLSI", IEEE Electronic Devices Letters EDL-2, pp. 126-9.
14. Vafai, K. and Tien, C.L. (1981), "Boundary and inertia effects on flow and heat transfer in porous media", International Journal of Heat and Mass Transfer, Vol. 24, pp. 195-203.
15. Weisberg, A. and Bau, H.H. (1992), "Analysis of microchannels for integrated cooling", International Journal of Heat and Mass Transfer, Vol. 35, pp. 2465-74.
16. Zhao, C.Y. and Lu, T.J. (2002), "Analysis of microchannel heat sinks for electronics cooling", International Journal of Heat and Mass Transfer, Vol. 45, pp. 4857-69.