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Volumn 9, Issue PARTS A AND B, 2012, Pages 405-412

Silicon interposer featuring novel electrical and optical TSVs

Author keywords

3D IC; Capacitance; Polymer clad TSVs; Polymer embedded vias; Silicon interposer; Stress; SU 8 and Parylene

Indexed keywords

ELECTRONICS PACKAGING; HEAT SINKS; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUIT MANUFACTURE; MICROCHANNELS; MICROFLUIDICS; OPTICAL COMMUNICATION; SILICON; THERMAL EXPANSION; THREE DIMENSIONAL INTEGRATED CIRCUITS; TIMING CIRCUITS;

EID: 84887313652     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2012-89742     Document Type: Conference Paper
Times cited : (5)

References (30)
  • 5
    • 79960398260 scopus 로고    scopus 로고
    • Electrical, optical and fluidic through-silicon vias for silicon interposer applications
    • Lake Buena Vista, Florida
    • Parekh, M. S., Thadesar, P. A., and Bakir, M. S., 2011, "Electrical, Optical and Fluidic Through-Silicon Vias for Silicon Interposer Applications, " 61st Electronic Components and Technology Conference, Lake Buena Vista, Florida, pp. 1992-1998.
    • (2011) 61st Electronic Components and Technology Conference , pp. 1992-1998
    • Parekh, M.S.1    Thadesar, P.A.2    Bakir, M.S.3
  • 8
    • 79953896186 scopus 로고    scopus 로고
    • Wafer level batch fabrication of silicon microchannel heat sink and electrical through-silicon vias for 3D ICs
    • San Jose, California
    • Zaveri, J., King, C. R., Yang, H. S., and Bakir, M. S., 2009, "Wafer Level Batch Fabrication of Silicon Microchannel Heat Sink and Electrical Through-Silicon Vias for 3D ICs, " IMAPS 42nd International Symposium on Microelectronics, San Jose, California, pp. 579-584.
    • (2009) IMAPS 42nd International Symposium on Microelectronics , pp. 579-584
    • Zaveri, J.1    King, C.R.2    Yang, H.S.3    Bakir, M.S.4
  • 14
    • 73349133689 scopus 로고    scopus 로고
    • Electrical modeling and characterization of through silicon via for three-dimensional ICs
    • Katti, G., Stucchi, M., De Meyer, K., and Dehaene, W., 2010, "Electrical Modeling and Characterization of Through Silicon Via For Three-Dimensional ICs, " IEEE Transactions on Electron Devices, Volume 50, Issue 1, pp. 256-262.
    • (2010) IEEE Transactions on Electron Devices , vol.50 , Issue.1 , pp. 256-262
    • Katti, G.1    Stucchi, M.2    De Meyer, K.3    Dehaene, W.4
  • 15
    • 77950935728 scopus 로고    scopus 로고
    • Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer
    • Singapore
    • Yoon, K., Kim G., Lee W., Song T., Lee J., Lee H., Park K., and Kim J., 2009, "Modeling and Analysis of Coupling Between TSVs, Metal, and RDL Interconnects in TSV-Based 3D IC With Silicon Interposer, " Electronics Packaging Technology Conference, Singapore, pp. 702-706.
    • (2009) Electronics Packaging Technology Conference , pp. 702-706
    • Yoon, K.1    Kim, G.2    Lee, W.3    Song, T.4    Lee, J.5    Lee, H.6    Park, K.7    Kim, J.8
  • 19
    • 0032098165 scopus 로고    scopus 로고
    • High frequency transmission line using micromachined polymer dielectric
    • Thorpe, J. R., Steenson, D. P., and Miles, R. E., 1998, "High Frequency Transmission Line Using Micromachined Polymer Dielectric, " Electronics Letters, Volume 34, Issue 12, pp. 1237-1238.
    • (1998) Electronics Letters , vol.34 , Issue.12 , pp. 1237-1238
    • Thorpe, J.R.1    Steenson, D.P.2    Miles, R.E.3
  • 21
    • 79952820386 scopus 로고    scopus 로고
    • Impact of near surface thermal stresses on interfacial reliability of through-silicon-viasfor 3-D interconnects
    • Ryu, S.-K., Lu, K.-H., Zhang, X., Im, J.-H., Ho, P. S., and Huang, R., 2011, "Impact of Near Surface Thermal Stresses on Interfacial Reliability of Through-Silicon-Viasfor 3-D Interconnects, " IEEE Transactions on Device and Materials Reliability, Volume 11, Issue 1, pp. 35-43.
    • (2011) IEEE Transactions on Device and Materials Reliability , vol.11 , Issue.1 , pp. 35-43
    • Ryu, S.-K.1    Lu, K.-H.2    Zhang, X.3    Im, J.-H.4    Ho, P.S.5    Huang, R.6
  • 22
    • 70349659173 scopus 로고    scopus 로고
    • Thermo-mechanical characterization of copper filled and polymer filled TSVs considering nonlinear material behaviors
    • San Diego, California
    • Chen, Z., Song, X., and Liu, S., 2009, "Thermo-Mechanical Characterization of Copper Filled and Polymer Filled TSVs Considering Nonlinear Material Behaviors, " 59th Electronic Components and Technology Conference, San Diego, California, pp. 1374-1380.
    • (2009) 59th Electronic Components and Technology Conference , pp. 1374-1380
    • Chen, Z.1    Song, X.2    Liu, S.3
  • 23
    • 34249675900 scopus 로고    scopus 로고
    • SU-8: A photoresist for high-aspect-ratio and 3D submicron lithography
    • Campo, A. D., and Greiner, C., 2007, "SU-8: A Photoresist For High-Aspect-Ratio and 3D Submicron Lithography, " Journal of Micromechanics and Microengineering, Volume 17, Number 6, pp. R81-R95.
    • (2007) Journal of Micromechanics and Microengineering , vol.17 , Issue.6
    • Campo, A.D.1    Greiner, C.2
  • 26
    • 80054753153 scopus 로고    scopus 로고
    • Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
    • Long Beach, California
    • Xie, B., Swaminathan, M., Han, K. J., and Xie, J., 2011, "Coupling Analysis of Through-Silicon Via (TSV) Arrays in Silicon Interposers for 3D Systems, " IEEE International Symposium on Electromagnetic Compatibility, Long Beach, California, pp. 16-21.
    • (2011) IEEE International Symposium on Electromagnetic Compatibility , pp. 16-21
    • Xie, B.1    Swaminathan, M.2    Han, K.J.3    Xie, J.4
  • 29
    • 66749093535 scopus 로고    scopus 로고
    • Optical connection between optical via hole in BGA package and optical waveguide on board
    • Oda, K., Matsubara, T., Watanabe, K. I., Tanaka, K., and Maetani, M., 2009, "Optical Connection between Optical Via Hole in BGA Package and Optical Waveguide on Board, " IEICE Transactions on Electronics, Volume E92.C, Issue 2, pp. 239-246.
    • (2009) IEICE Transactions on Electronics , vol.E92C , Issue.2 , pp. 239-246
    • Oda, K.1    Matsubara, T.2    Watanabe, K.I.3    Tanaka, K.4    Maetani, M.5
  • 30
    • 84897098267 scopus 로고    scopus 로고
    • Optoelectronic package having optical waveguide hole and 4-ch × 10-Gb/s chip-to-chip interconnection using thin-film waveguide connector
    • San Diego, California
    • Takagi, Y., Suzuki, A., Horio, T., Ohno, T., Kojima, T., Takada, T., Iio, S., Obayashi, K., and Okuyama, M., 2009, "Optoelectronic Package having Optical Waveguide Hole and 4-ch × 10-Gb/s Chip-to-Chip Interconnection using Thin-film Waveguide Connector, " IEEE Conference on Optical Fiber Communication, San Diego, California, pp. 1-3.
    • (2009) IEEE Conference on Optical Fiber Communication , pp. 1-3
    • Takagi, Y.1    Suzuki, A.2    Horio, T.3    Ohno, T.4    Kojima, T.5    Takada, T.6    Iio, S.7    Obayashi, K.8    Okuyama, M.9


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.