Fine pitch TSV integration in silicon micropin-fin heat sinks for 3D ICs

2012 IEEE International Interconnect Technology Conference, IITC 2012

Volumn , Issue , 2012, Pages

  Dembla, Ashish ^a   Zhang, Yue ^a   Bakir, Muhannad S ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; 3D SYSTEMS; CO-DESIGNS; ELECTRICAL INTERCONNECTS; FINE PITCH; HEAT REMOVAL; HIGH ASPECT RATIO; JUNCTION TEMPERATURES; POWER DENSITIES;

ASPECT RATIO;

HEAT SINKS;

EID: 84866725903     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2012.6251587     Document Type: Conference Paper

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