TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs

Proceedings of the International Symposium on Physical Design

Volumn , Issue , 2012, Pages 113-118

  Shi, Bing ^a   Srivastava, Ankur ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

3D IC; Liquid cooling; Micro channel; Power; TSV

Indexed keywords

COOLING EFFECTIVENESS; HIGH DENSITY; INFRASTRUCTURE DESIGN; LIQUID COOLING; POWER; PUMPING POWER; STRAIGHT CHANNEL; TSV;

DESIGN; LIQUIDS; THREE DIMENSIONAL;

COOLING;

EID: 84860251766     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/2160916.2160941     Document Type: Conference Paper

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