Investigation of parylene-C on the performance of millimeter-wave circuits

IEEE Transactions on Microwave Theory and Techniques

Volumn 54, Issue 8, 2006, Pages 3417-3424

  Kärnfelt, Camilla ^a,b   Tegnander, Christina ^c   Rudnicki, Janusz ^b   Starski, J Piotr ^a,b   Emrich, Anders ^c  

^a IEEE   (Sweden)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c CLYDE SPACE LTD   (United Kingdom)

Author keywords

Coatings; Dielectric loss; Dissipation factor; Flip chip; Humidity protection; Monolithic microwave integrated circuits (MMICs); Parylene; Poly para xylylene; Resonators

Indexed keywords

DIELECTRIC LOSS; DISSIPATION FACTOR; HUMIDITY PROTECTION; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS (MMIC); PARYLENE; POLY-PARA-XYLYLENE;

COATINGS; DIELECTRIC PROPERTIES; ELECTROMAGNETIC WAVES; ENERGY DISSIPATION; FLIP CHIP DEVICES; NATURAL FREQUENCIES; RESONATORS;

INTEGRATED CIRCUITS;

EID: 33747296847     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2006.877834     Document Type: Article

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