Development of gold based solder candidates for flip chip assembly

Microelectronics Reliability

Volumn 49, Issue 3, 2009, Pages 323-330

  Chidambaram, Vivek ^a   Hald, John ^a   Hattel, Jesper ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATIONS; BRAZING; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; ENVIRONMENTAL IMPACT; FLIP CHIP DEVICES; HEALTH HAZARDS; MICROELECTRONICS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; SULFUR COMPOUNDS; SYSTEMS ENGINEERING; WELDING;

BULK SOLDERS; CALPHAD APPROACHES; CRITICAL ISSUES; ELECTRONIC PRODUCTS; FLIP CHIP TECHNOLOGIES; FLIP-CHIP ASSEMBLIES; INTERCONNECTION TECHNOLOGIES; INTERMETALLIC COMPOUNDS; LEAD CONTAINING SOLDERS; MICROELECTRONICS INDUSTRIES; MISSION-CRITICAL OPERATIONS; P SYSTEMS; PACKAGING APPLICATIONS; SOLDER ALLOYS; SOLDER JOINTS; SYSTEM FAILURES; UNDER-BUMP METALLIZATION; WETTING REACTIONS; WIRE BONDINGS;

LEAD;

EID: 61349154151     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.12.012     Document Type: Article

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