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Volumn 484, Issue 1-2, 2009, Pages 185-189
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Interfacial reaction of gas-atomized Sn-Zn solder containing Ni and Cu additives
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Author keywords
Atomization; Intermetallic compound; Lead free solder; Sn Zn; Solder paste
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Indexed keywords
ADHESION STRENGTHS;
CU ADDITIVE;
CU SUBSTRATE;
IMC LAYER;
INTERFACIAL REACTIONS;
INTERMETALLIC COMPOUND;
INTERMETALLIC COMPOUNDS;
JOINT INTERFACES;
LEAD FREE SOLDERS;
LEAD-FREE SOLDER;
LOW TEMPERATURES;
MELTING TEMPERATURES;
PRACTICAL USE;
SN-PB EUTECTIC SOLDER;
SN-ZN;
SN-ZN SOLDER;
SNPB SOLDER;
SOLDER ALLOYS;
SOLDER PASTE;
ZN-BASED ALLOYS;
ALLOYS;
ATOMIZATION;
COPPER ALLOYS;
JETS;
LEAD;
LEAD COMPOUNDS;
MELTING POINT;
NICKEL;
SEMICONDUCTING INTERMETALLICS;
SOLDERING ALLOYS;
TIN ALLOYS;
ZINC;
ZINC ALLOYS;
TIN;
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EID: 69949089589
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2009.05.088 Document Type: Article |
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Times cited : (17)
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References (16)
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