메뉴 건너뛰기




Volumn , Issue , 2005, Pages

Adhesives Technology for Electronic Applications

Author keywords

[No Author keywords available]

Indexed keywords


EID: 84882116845     PISSN: None     EISSN: None     Source Type: Book    
DOI: None     Document Type: Book
Times cited : (44)

References (453)
  • 1
    • 5844303202 scopus 로고
    • New Die Attach Material For Hermetic Packaging
    • EE83-145, Phoenix, AZ
    • Dietz R.L., Winder L. New Die Attach Material For Hermetic Packaging. Proc. Mfg. Eng EMTAS Conf. 1983, EE83-145, Phoenix, AZ.
    • (1983) Proc. Mfg. Eng EMTAS Conf.
    • Dietz, R.L.1    Winder, L.2
  • 3
    • 0029502310 scopus 로고
    • Reliability of Novel Die Attach Adhesive for Snap Curing
    • IEEE
    • Galloway D.P., et al. Reliability of Novel Die Attach Adhesive for Snap Curing. Proc. IEMT Symp. 1995, IEEE.
    • (1995) Proc. IEMT Symp.
    • Galloway, D.P.1
  • 9
    • 84882155170 scopus 로고    scopus 로고
    • Epo-Tek H77 Product Sheet, Epoxy Technology.
    • Epo-Tek H77 Product Sheet, Epoxy Technology.
  • 18
    • 0003621055 scopus 로고
    • Kluwer Academic Publishers, Dordrecht
    • Lau J.H. Chip on Board 1994, Kluwer Academic Publishers, Dordrecht.
    • (1994) Chip on Board
    • Lau, J.H.1
  • 20
    • 0032141318 scopus 로고    scopus 로고
    • Engineering Surfaces in Ceramic Pin Grid Array Packaging to Inhibit Epoxy Bleeding
    • Aug.
    • Tan N., Lim K., Chin B., Bourdillon A. Engineering Surfaces in Ceramic Pin Grid Array Packaging to Inhibit Epoxy Bleeding. Hewlett-Packard J. Aug. 1998.
    • (1998) Hewlett-Packard J.
    • Tan, N.1    Lim, K.2    Chin, B.3    Bourdillon, A.4
  • 22
    • 84882176704 scopus 로고    scopus 로고
    • Let's Talk Chip Scale
    • IPC Supplement, Apr.
    • Bauer C.E. Let's Talk Chip Scale. Circuits Assembly Apr. 1997, IPC Supplement.
    • (1997) Circuits Assembly
    • Bauer, C.E.1
  • 23
    • 9744251619 scopus 로고    scopus 로고
    • Chip Scale vs Flip Chip: Issues to Consider
    • Nov.
    • Ngulty T.A., Ekere N.N. Chip Scale vs Flip Chip: Issues to Consider. Circuits Assembly Nov. 1999.
    • (1999) Circuits Assembly
    • Ngulty, T.A.1    Ekere, N.N.2
  • 25
    • 12944317214 scopus 로고    scopus 로고
    • High-Density Packaging: The Next Interconnect Challenge
    • Feb.
    • Baliga J. High-Density Packaging: The Next Interconnect Challenge. Semiconductor Intl. Feb. 2000, 91-94.
    • (2000) Semiconductor Intl. , pp. 91-94
    • Baliga, J.1
  • 26
    • 0035390620 scopus 로고    scopus 로고
    • Advantages of System on a Package and System on a Chip
    • Jul.
    • Karnezas M. Advantages of System on a Package and System on a Chip. Electronic Packaging and Production Jul. 2001.
    • (2001) Electronic Packaging and Production
    • Karnezas, M.1
  • 27
    • 84882222697 scopus 로고    scopus 로고
    • Lead-on-Chip Package Extends the Use of Wire Bonding and Leadframe Technology
    • Jul./Aug.
    • Francis D., Jardine L. Lead-on-Chip Package Extends the Use of Wire Bonding and Leadframe Technology. ChipScale Review Jul./Aug. 1999.
    • (1999) ChipScale Review
    • Francis, D.1    Jardine, L.2
  • 30
  • 32
    • 84882206435 scopus 로고
    • High Density Interconnects Using Laser Lithography
    • Levinson L.M., et al. High Density Interconnects Using Laser Lithography. Proc. NEPCON West 1989.
    • (1989) Proc. NEPCON West
    • Levinson, L.M.1
  • 37
    • 0024097111 scopus 로고
    • New Epoxies for Hybrid Circuit Evaluation
    • Oct.
    • Burkhart A. New Epoxies for Hybrid Circuit Evaluation. Hybrid Circuit Technol. Oct. 1988.
    • (1988) Hybrid Circuit Technol.
    • Burkhart, A.1
  • 38
    • 0016347740 scopus 로고
    • The Reliability of Epoxy as a Die Attach in Digital and Linear Integrated Circuits
    • Apr.
    • Pietrucha B.M., Reiss E.M. The Reliability of Epoxy as a Die Attach in Digital and Linear Integrated Circuits. Proc. 12th Annual Reliability Physics Symp. Apr. 1974, 234-238.
    • (1974) Proc. 12th Annual Reliability Physics Symp. , pp. 234-238
    • Pietrucha, B.M.1    Reiss, E.M.2
  • 40
    • 84882157779 scopus 로고
    • Anaerobic Adhesives
    • Marcel Dekker, A. Pizzi, K.L. Mittal (Eds.)
    • Rich R.D. Anaerobic Adhesives. Handbook of Adhesive Technology 1994, Marcel Dekker. A. Pizzi, K.L. Mittal (Eds.).
    • (1994) Handbook of Adhesive Technology
    • Rich, R.D.1
  • 41
    • 84882191555 scopus 로고
    • Design Guidelines For Use of Adhesives and Organic Coatings in Hybrid Microcircuits
    • Dec.
    • Design Guidelines For Use of Adhesives and Organic Coatings in Hybrid Microcircuits. NASA Technical Memorandum TM X-64908 Dec. 1974.
    • (1974) NASA Technical Memorandum TM X-64908
  • 42
    • 84882098662 scopus 로고    scopus 로고
    • Marshall Space Flight Center Drawing MSFC 16A02053.
    • Marshall Space Flight Center Drawing MSFC 16A02053.
  • 43
    • 84882080223 scopus 로고
    • Development of a Qualification Standard for Adhesives Used in Hybrid Microcircuits
    • Dec.
    • Licari J.J., Weigand B.L., Soykin C.A. Development of a Qualification Standard for Adhesives Used in Hybrid Microcircuits. NASA CR-161978 Dec. 1981.
    • (1981) NASA CR-161978
    • Licari, J.J.1    Weigand, B.L.2    Soykin, C.A.3
  • 45
    • 0021541964 scopus 로고
    • Polymeric Materials and the New Mil Specs: A Hybrid Users View
    • Ebel G.H., Englekey H.A. Polymeric Materials and the New Mil Specs: A Hybrid Users View. Proc. ISHM 1984, 189-193.
    • (1984) Proc. ISHM , pp. 189-193
    • Ebel, G.H.1    Englekey, H.A.2
  • 46
    • 84882230810 scopus 로고    scopus 로고
    • Microcircuits, Test Method Standard, Method 5011, MIL-STD-883F, DSCC Columbus, OH.
    • Microcircuits, Test Method Standard, Method 5011, MIL-STD-883F, DSCC Columbus, OH.
  • 47
    • 84882104674 scopus 로고    scopus 로고
    • Preparing for Liftoff
    • Aug.
    • Valero G. Preparing for Liftoff. Adhesives Age Aug. 1999, 42(8).
    • (1999) Adhesives Age , vol.42 , Issue.8
    • Valero, G.1
  • 48
    • 84882051691 scopus 로고    scopus 로고
    • Oct.
    • Adhesives Age Oct. 2000, 43(10).
    • (2000) Adhesives Age , vol.43 , Issue.10
  • 52
    • 0022097946 scopus 로고
    • A Critical Review of VLSI Die Attachment in High Reliability Applications
    • Jul.
    • Shukla R.K., Mencinger N.P. A Critical Review of VLSI Die Attachment in High Reliability Applications. Solid State Technology Jul. 1985, 67-74.
    • (1985) Solid State Technology , pp. 67-74
    • Shukla, R.K.1    Mencinger, N.P.2
  • 53
    • 0032141318 scopus 로고    scopus 로고
    • Engineering Surfaces in Ceramic Pin Grid Array Packaging to Inhibit Epoxy Bleeding
    • Aug.
    • Tan N., Chin B., Lim K.H.K., Bourdillon A.J. Engineering Surfaces in Ceramic Pin Grid Array Packaging to Inhibit Epoxy Bleeding. Hewlett Packard Journal Aug. 1998.
    • (1998) Hewlett Packard Journal
    • Tan, N.1    Chin, B.2    Lim, K.H.K.3    Bourdillon, A.J.4
  • 55
    • 84882066520 scopus 로고
    • Adhesion Science and Technology Training Course
    • Center for Professional Excellence, San Mateo, CA, Sep.
    • Mittal K.L. Adhesion Science and Technology Training Course. Appendices A and E Sep. 1986, Center for Professional Excellence, San Mateo, CA.
    • (1986) Appendices A and E
    • Mittal, K.L.1
  • 56
    • 84882184916 scopus 로고    scopus 로고
    • Flexible Conductive Adhesive as Solder Replacement in Flip Chip Interconnection
    • Chung K., Ozguz V. Flexible Conductive Adhesive as Solder Replacement in Flip Chip Interconnection. Proc. Semicon. West 1998 1998, 127-131.
    • (1998) Proc. Semicon. West 1998 , pp. 127-131
    • Chung, K.1    Ozguz, V.2
  • 57
    • 84882166587 scopus 로고    scopus 로고
    • Aug. 26,
    • Bonding Solutions, 3M Co. Aug. 26, 2002, http://www.www.3M.com/reclosables/html/fundamentals.html.
    • (2002) Bonding Solutions, 3M Co.
  • 58
    • 84882188005 scopus 로고    scopus 로고
    • Basics of Surface Wetting and Pretreatment Methods
    • The Sabreen Group, Jul. 16,
    • Sabreen S. Basics of Surface Wetting and Pretreatment Methods. Plastics Technical Reference Library Jul. 16, 2001, The Sabreen Group.
    • (2001) Plastics Technical Reference Library
    • Sabreen, S.1
  • 60
    • 84882062288 scopus 로고    scopus 로고
    • Die Attach Adhesives: A Guide to Material Properties and Applications, Epoxy Technology, Technical Paper GB-48.
    • Hannafin, J.J., Pernice, R.F., Estes, R.H., Die Attach Adhesives: A Guide to Material Properties and Applications, Epoxy Technology, Technical Paper GB-48.
    • Hannafin, J.J.1    Pernice, R.F.2    Estes, R.H.3
  • 61
    • 84882069878 scopus 로고    scopus 로고
    • Selecting the Right Die-Attach Adhesive
    • McCabe J.D. Selecting the Right Die-Attach Adhesive. High Density Interconnect Jul. 2001, 32-36.
    • (2001) High Density Interconnect , pp. 32-36
    • McCabe, J.D.1
  • 64
    • 84882070986 scopus 로고    scopus 로고
    • Ablebond 84-1 LMINB, Ablestik Laboratories Technical Data Sheet (Oct. 2000); NB1, revised (Jul. 2003)
    • Ablebond 84-1 LMINB, Ablestik Laboratories Technical Data Sheet (Oct. 2000); NB1, revised (Jul. 2003).
  • 66
  • 68
    • 84882055021 scopus 로고    scopus 로고
    • Encapsulants for Chip-on-Board and Chip Scale Packaging
    • Feb.
    • Koh W. Encapsulants for Chip-on-Board and Chip Scale Packaging. Dexter Technical Paper Feb. 1996.
    • (1996) Dexter Technical Paper
    • Koh, W.1
  • 69
    • 84882126734 scopus 로고    scopus 로고
    • 3561 (Nov. 1996); 3563 (Dec. 1999); and 3567 (Feb. 2000), Feb.
    • Loctite Technical Data Sheets Feb. 1997, 3560. 3561 (Nov. 1996); 3563 (Dec. 1999); and 3567 (Feb. 2000).
    • (1997) Loctite Technical Data Sheets , pp. 3560
  • 70
    • 84882225017 scopus 로고
    • Rheology for the Bewildered: A Loctite Guide
    • Aug.
    • Fay H.G. Rheology for the Bewildered: A Loctite Guide. Loctite Technical Paper Aug. 1977.
    • (1977) Loctite Technical Paper
    • Fay, H.G.1
  • 74
    • 0003536344 scopus 로고    scopus 로고
    • Silver Flake Increases Performance of Conductive Adhesive
    • Jun./Jul.
    • McNeilly K., Pernice R.F. Silver Flake Increases Performance of Conductive Adhesive. Advanced Packaging Jun./Jul. 1999.
    • (1999) Advanced Packaging
    • McNeilly, K.1    Pernice, R.F.2
  • 77
    • 84882095036 scopus 로고    scopus 로고
    • Flip-Chip Process Guidelines and Considerations
    • Nov.
    • Bacher B. Flip-Chip Process Guidelines and Considerations. Dexter Technical Paper Nov. 1999.
    • (1999) Dexter Technical Paper
    • Bacher, B.1
  • 80
    • 84882081725 scopus 로고    scopus 로고
    • Technical Data Sheets for JMI 8806 (Dec. 2,1999); JMI 8802B (UF8802B) Honeywell (Oct. 2000); Technical Data Sheets for Ablefill JM8806 (Jan. 2002); Ablefill UF8802B, Ablestik Laboratories (Jul. 2001)
    • Technical Data Sheets for JMI 8806 (Dec. 2,1999); JMI 8802B (UF8802B) Honeywell (Oct. 2000); Technical Data Sheets for Ablefill JM8806 (Jan. 2002); Ablefill UF8802B, Ablestik Laboratories (Jul. 2001).
  • 81
    • 84882203688 scopus 로고    scopus 로고
    • The Effects of New Trends in Flip-Chip Packages on Automating the Underfill Process
    • Mar.
    • Newbold J., Lewis A. The Effects of New Trends in Flip-Chip Packages on Automating the Underfill Process. Proc. NEPCON West Mar. 1998.
    • (1998) Proc. NEPCON West
    • Newbold, J.1    Lewis, A.2
  • 82
    • 0343426646 scopus 로고    scopus 로고
    • The Chemistry and Physics of Underfill
    • Anaheim, CA, Mar. 3-5,
    • Gilleo K. The Chemistry and Physics of Underfill. Proc. NEPCON West Mar. 3-5, 1998, 280-292. Anaheim, CA.
    • (1998) Proc. NEPCON West , pp. 280-292
    • Gilleo, K.1
  • 91
    • 0021120071 scopus 로고
    • Development of Adhesive Die Attach Technology in CerDip Packages: Materials Issues
    • Jan.
    • Moghadan F.K. Development of Adhesive Die Attach Technology in CerDip Packages: Materials Issues. Solid State Technology Jan. 1984.
    • (1984) Solid State Technology
    • Moghadan, F.K.1
  • 92
    • 0023420630 scopus 로고
    • A Novel Approach-Thermoplastic Die Attach Adhesive
    • Sep.
    • Ying L. A Novel Approach-Thermoplastic Die Attach Adhesive. Solid State Technol. Sep. 1987.
    • (1987) Solid State Technol.
    • Ying, L.1
  • 94
    • 0029288407 scopus 로고
    • Die Attach Materials and Methods
    • Apr.
    • Trigwell S. Die Attach Materials and Methods. Solid State Technol. Apr. 1995.
    • (1995) Solid State Technol.
    • Trigwell, S.1
  • 96
    • 0033295041 scopus 로고    scopus 로고
    • Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
    • Sep.
    • Lu D., Wong C.P. Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems. J. Electronic Mfg. Sep. 1999, 9(3):223-232.
    • (1999) J. Electronic Mfg. , vol.9 , Issue.3 , pp. 223-232
    • Lu, D.1    Wong, C.P.2
  • 101
    • 0037607752 scopus 로고    scopus 로고
    • Anisotropic Conductive Adhesive Films For Flip-Chip Interconnection
    • Electrochemical Publications Ltd., Ch. 10, J. Liu (Ed.)
    • Watanabe I., Takemura K. Anisotropic Conductive Adhesive Films For Flip-Chip Interconnection. Conductive Adhesives for Electronic Pack-aging 1999, Electrochemical Publications Ltd., Ch. 10. J. Liu (Ed.).
    • (1999) Conductive Adhesives for Electronic Pack-aging
    • Watanabe, I.1    Takemura, K.2
  • 103
    • 0021451308 scopus 로고
    • Conductive Adhesives: How and Where They Work
    • Jun.
    • Bolger J.C., Morano S.L. Conductive Adhesives: How and Where They Work. Adhesives Age Jun. 1984.
    • (1984) Adhesives Age
    • Bolger, J.C.1    Morano, S.L.2
  • 104
    • 0029717186 scopus 로고    scopus 로고
    • Synergistic Combinations of Thermally Conductive Fillers in Polymer Matrices
    • I, Feb.
    • Cross R. Synergistic Combinations of Thermally Conductive Fillers in Polymer Matrices. Proc. NEPCON West, 1996 Feb. 1996, 531-538. I.
    • (1996) Proc. NEPCON West, 1996 , pp. 531-538
    • Cross, R.1
  • 105
    • 84882133307 scopus 로고    scopus 로고
    • Technical Data Sheet for ME-7156, AI Technologies
    • Technical Data Sheet for ME-7156, AI Technologies.
  • 106
    • 84882112037 scopus 로고
    • MIL-STD-883, Method 1012.1, Nov.
    • Thermal Characteristics Nov. 1980, MIL-STD-883, Method 1012.1.
    • (1980) Thermal Characteristics
  • 107
    • 84882222420 scopus 로고    scopus 로고
    • Steady State Heat Flux Measurement and Thermal Transmission Properties by Measure of Heat Flow Meter Apparatus, ASTM C518, Am. Soc. Testing and Materials
    • Steady State Heat Flux Measurement and Thermal Transmission Properties by Measure of Heat Flow Meter Apparatus, ASTM C518, Am. Soc. Testing and Materials.
  • 109
    • 0024749960 scopus 로고
    • Formulating Custom-Tailored Thermal Transfer Adhesives
    • Oct.
    • Hermansen R.D., Tunick S.A. Formulating Custom-Tailored Thermal Transfer Adhesives. Adhesives Age Oct. 1989.
    • (1989) Adhesives Age
    • Hermansen, R.D.1    Tunick, S.A.2
  • 111
    • 84882204886 scopus 로고    scopus 로고
    • Beyond Flip Chip: Underfills Enhance CSP Reliability
    • Mar.
    • Yaeger E., Carson G. Beyond Flip Chip: Underfills Enhance CSP Reliability. Chip Scale Review Mar. 2001.
    • (2001) Chip Scale Review
    • Yaeger, E.1    Carson, G.2
  • 112
    • 8444244432 scopus 로고    scopus 로고
    • How Dielectric Tg Affects Substrate Performance
    • Nov./Dec.
    • Ng L.V., Fick H.J., Bui M. How Dielectric Tg Affects Substrate Performance. Advanced Packaging Nov./Dec. 2000.
    • (2000) Advanced Packaging
    • Ng, L.V.1    Fick, H.J.2    Bui, M.3
  • 113
    • 84882197046 scopus 로고
    • Low-Stress Adhesive
    • Winter
    • Loh K.I. Low-Stress Adhesive. Advanced Packaging Winter 1993, 18-22.
    • (1993) Advanced Packaging , pp. 18-22
    • Loh, K.I.1
  • 117
    • 84882220283 scopus 로고
    • Die Attach in Hi-Rel PDIPS: Polyimide or Low-Chloride Epoxies
    • Mooney C.T., Bolger J. Die Attach in Hi-Rel PDIPS: Polyimide or Low-Chloride Epoxies. Trans. IEEE 1984.
    • (1984) Trans. IEEE
    • Mooney, C.T.1    Bolger, J.2
  • 123
    • 84882207891 scopus 로고    scopus 로고
    • Effects of Tg and CTE on Semiconductor Encapsulants, Loctite Electronics Technical Paper.
    • Konarski, M.M., Effects of Tg and CTE on Semiconductor Encapsulants, Loctite Electronics Technical Paper.
    • Konarski, M.M.1
  • 124
    • 84882142000 scopus 로고    scopus 로고
    • Effects of Processing Parameters on the Performance of Epoxy Encapsulant Materials
    • Dec.
    • Naito C.M., Todd M. Effects of Processing Parameters on the Performance of Epoxy Encapsulant Materials. Dexter Technical Paper Dec. 2000.
    • (2000) Dexter Technical Paper
    • Naito, C.M.1    Todd, M.2
  • 130
    • 84882223246 scopus 로고    scopus 로고
    • Dow Liquid Epoxy Resins, Form 296-224-783R, Dow Chemical Co.
    • Dow Liquid Epoxy Resins, Form 296-224-783R, Dow Chemical Co.
  • 134
  • 135
    • 0024050522 scopus 로고
    • Frozen Adhesive Advantages in Electronic Manufacturing
    • Jul.
    • Rocheleau H. Frozen Adhesive Advantages in Electronic Manufacturing. Electronic Mfg. Jul. 1988, 18-19.
    • (1988) Electronic Mfg. , pp. 18-19
    • Rocheleau, H.1
  • 140
    • 70349218325 scopus 로고    scopus 로고
    • Anderson & Associates, Jul. 30,
    • Product Data Sheets Jul. 30, 2001, Anderson & Associates. http://www.andisil.com.
    • (2001) Product Data Sheets
  • 146
    • 84882128434 scopus 로고    scopus 로고
    • Ablebond 71-1
    • Ablestik Laboratories, Dec.
    • Ablebond 71-1. Technical Data Sheet Dec. 2003, Ablestik Laboratories.
    • (2003) Technical Data Sheet
  • 147
    • 84947352660 scopus 로고
    • Adhesion of Polyimides to Metals and Metal Oxides
    • Buchwalter L.P. Adhesion of Polyimides to Metals and Metal Oxides. J. Adhesion Sci. Technol. 1987, 1(4):341-347.
    • (1987) J. Adhesion Sci. Technol. , vol.1 , Issue.4 , pp. 341-347
    • Buchwalter, L.P.1
  • 148
    • 0023420630 scopus 로고
    • A Novel Approach - Thermoplastic Die Attach Adhesive
    • Sep.
    • Ying L. A Novel Approach - Thermoplastic Die Attach Adhesive. Solid State Technol. Sep. 1987.
    • (1987) Solid State Technol.
    • Ying, L.1
  • 151
    • 84882052123 scopus 로고    scopus 로고
    • Sartomer Corp., Product Bulletin, Aug. 1,
    • Poly BD Resins Aug. 1, 2001, Sartomer Corp., Product Bulletin.
    • (2001) Poly BD Resins
  • 153
    • 84882112662 scopus 로고
    • Pursuing the Perfect Paste: A Novel Cyanate Ester Die Attach Adhesive for Plastic Packaging
    • Nov.
    • Chien I.Y., Nguyen M.N. Pursuing the Perfect Paste: A Novel Cyanate Ester Die Attach Adhesive for Plastic Packaging. Solid State Technol. Nov. 1994.
    • (1994) Solid State Technol.
    • Chien, I.Y.1    Nguyen, M.N.2
  • 155
    • 84882141278 scopus 로고    scopus 로고
    • Catalytic Reaction in a Cyanate Based Adhesive
    • Dept. of Chemistry, Natl. Univ. of Singapore
    • Hanafiah N.M., Rasiah I., Jaenicke S. Catalytic Reaction in a Cyanate Based Adhesive. Applied Chem. Honors Project 2000/2001, Dept. of Chemistry, Natl. Univ. of Singapore.
    • (2001) Applied Chem. Honors Project
    • Hanafiah, N.M.1    Rasiah, I.2    Jaenicke, S.3
  • 156
    • 0005258813 scopus 로고    scopus 로고
    • Cyclotrimerization Reactivities of Mono-and Difunctional Cyanates
    • Bauer J., Hoper L., Bauer M. Cyclotrimerization Reactivities of Mono-and Difunctional Cyanates. Macromol. Chem. Physics 1998.
    • (1998) Macromol. Chem. Physics
    • Bauer, J.1    Hoper, L.2    Bauer, M.3
  • 162
    • 84882200533 scopus 로고    scopus 로고
    • Low Moisture Polymer for Die Bonding Fights Delamination
    • Johnson-Matthey Publication, Mar.
    • Low Moisture Polymer for Die Bonding Fights Delamination. Semiconductor Intl. Mar. 1998, Johnson-Matthey Publication.
    • (1998) Semiconductor Intl.
  • 164
    • 33745479753 scopus 로고
    • Thermal Conductivity of Epoxy Adhesives Filled with Silver Particles
    • Apr.
    • Bjorneklett A., Halbo L., Kristiansen H. Thermal Conductivity of Epoxy Adhesives Filled with Silver Particles. Intl. J. Adhesion Apr. 1992, 12(2).
    • (1992) Intl. J. Adhesion , vol.12 , Issue.2
    • Bjorneklett, A.1    Halbo, L.2    Kristiansen, H.3
  • 166
    • 0024865335 scopus 로고
    • Qualification of a High-Purity, Low Outgassing Conductive Adhesive for Hybrid Microcircuit Assembly
    • Jun.
    • Swanson D.W. Qualification of a High-Purity, Low Outgassing Conductive Adhesive for Hybrid Microcircuit Assembly. Proc. 3rd Annual SAMPE Electronic Materials and Processes Conf. Jun. 1989.
    • (1989) Proc. 3rd Annual SAMPE Electronic Materials and Processes Conf.
    • Swanson, D.W.1
  • 169
    • 84882157902 scopus 로고    scopus 로고
    • Advanced Ceramics Co.
    • ® Brochure 2001, Advanced Ceramics Co.
    • (2001) reg; Brochure
  • 170
    • 84882099764 scopus 로고    scopus 로고
    • AI Technology Catalog, AI Technology, Princeton Junction, NJ.
    • AI Technology Catalog, AI Technology, Princeton Junction, NJ.
  • 176
    • 84882106328 scopus 로고    scopus 로고
    • Electrically Conductive Adhesives in SMT -The Influence of Adhesive Composition on Mechanical and Electrical Properties
    • Ryszard K., Mosicicki S. Electrically Conductive Adhesives in SMT -The Influence of Adhesive Composition on Mechanical and Electrical Properties. Proc. IMAPS Poland Conf. 2000, 199-206.
    • (2000) Proc. IMAPS Poland Conf. , pp. 199-206
    • Ryszard, K.1    Mosicicki, S.2
  • 177
    • 0033295041 scopus 로고    scopus 로고
    • Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
    • Sep.
    • Lu D., Wong C.P. Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems. J. Electronics Mfg. Sep. 1999, 9(3):223-232.
    • (1999) J. Electronics Mfg. , vol.9 , Issue.3 , pp. 223-232
    • Lu, D.1    Wong, C.P.2
  • 178
    • 84882144604 scopus 로고
    • Electrically Conductive Adhesives: Effect of Particle Composition and Size Distribution
    • Lyons A.M. Electrically Conductive Adhesives: Effect of Particle Composition and Size Distribution. Society of Plastics Engineers Annual Tech. Conference 1990, 843-845.
    • (1990) Society of Plastics Engineers Annual Tech. Conference , pp. 843-845
    • Lyons, A.M.1
  • 179
    • 0023433746 scopus 로고
    • The Behavior of Silver Flakes in Conductive Epoxy Adhesives
    • Oct.
    • Pandiri S.M. The Behavior of Silver Flakes in Conductive Epoxy Adhesives. Adhesives Age Oct. 1987.
    • (1987) Adhesives Age
    • Pandiri, S.M.1
  • 180
    • 84882234955 scopus 로고    scopus 로고
    • Degussa Filler Data Sheets, Degussa AG, Dresden, Germany.
    • Degussa Filler Data Sheets, Degussa AG, Dresden, Germany.
  • 181
    • 84882125320 scopus 로고    scopus 로고
    • Filler Data Sheets, Technic, Inc.
    • Filler Data Sheets, Technic, Inc.
  • 182
    • 84882098111 scopus 로고    scopus 로고
    • HRP Brochure, Precious Metal Products, HRP Metals, Inc., Sewickley, PA.
    • HRP Brochure, Precious Metal Products, HRP Metals, Inc., Sewickley, PA.
  • 186
    • 84882061009 scopus 로고    scopus 로고
    • Formulating with Dow Epoxy Resins: Casting, Potting, and Encapsulation, Dow Form 296-363-883.
    • Formulating with Dow Epoxy Resins: Casting, Potting, and Encapsulation, Dow Form 296-363-883.
  • 190
  • 192
    • 84882065962 scopus 로고    scopus 로고
    • Stress Effects of Epoxy Adhesives on Ceramic Substrates and Magnetics
    • Oct.
    • Swanson D.W., Enlow L.R. Stress Effects of Epoxy Adhesives on Ceramic Substrates and Magnetics. Proc. IMAPS Conf. Oct. 1999.
    • (1999) Proc. IMAPS Conf.
    • Swanson, D.W.1    Enlow, L.R.2
  • 193
    • 0035310644 scopus 로고    scopus 로고
    • Stress Effects of Epoxy Adhesives on Ceramic Substrates and Magnetics
    • Swanson D.W., Enlow L.R. Stress Effects of Epoxy Adhesives on Ceramic Substrates and Magnetics. Microelectronics Reliability 2001, 41:499-510.
    • (2001) Microelectronics Reliability , vol.41 , pp. 499-510
    • Swanson, D.W.1    Enlow, L.R.2
  • 194
    • 84882138407 scopus 로고    scopus 로고
    • Test Methods and Procedures for Microelectronics; Evaluation and Acceptance Procedures for Polymeric Adhesives, MIL-STD-883, Method 5011.
    • Test Methods and Procedures for Microelectronics; Evaluation and Acceptance Procedures for Polymeric Adhesives, MIL-STD-883, Method 5011.
  • 195
    • 84882160625 scopus 로고    scopus 로고
    • Performance Specification, Hybrid Microcircuits, General Specification, MIL-PRF-38534.
    • Performance Specification, Hybrid Microcircuits, General Specification, MIL-PRF-38534.
  • 196
    • 0024170119 scopus 로고
    • Adhesive Bonding Hybrid Microcircuit Substrates with PEEK Thermoplastic Film
    • Shores A.A. Adhesive Bonding Hybrid Microcircuit Substrates with PEEK Thermoplastic Film. ISHM Proc. 1988, 11(2).
    • (1988) ISHM Proc. , vol.11 , Issue.2
    • Shores, A.A.1
  • 197
    • 84882048787 scopus 로고    scopus 로고
    • Electronic and Electrical Component Parts, MIL-STD-202, Test Method Standard.
    • Electronic and Electrical Component Parts, MIL-STD-202, Test Method Standard.
  • 201
    • 84882140135 scopus 로고    scopus 로고
    • Silver-Filled Cyanate Ester Die Attach Material, Product Data Sheet for JMI7000, Johnson-Matthey.
    • Silver-Filled Cyanate Ester Die Attach Material, Product Data Sheet for JMI7000, Johnson-Matthey.
  • 202
    • 84882150626 scopus 로고    scopus 로고
    • EX-1502-1, Bryte Technologies.
    • EX-1502-1, Bryte Technologies.
  • 204
    • 84882186908 scopus 로고    scopus 로고
    • Technical Data Sheets for LC 1100 and 1200 Series Light Curing Adhesives, 3M Co.
    • Technical Data Sheets for LC 1100 and 1200 Series Light Curing Adhesives, 3M Co.
  • 206
    • 84882103756 scopus 로고    scopus 로고
    • Ablefilm 504-1
    • Ablestik Laboratories, Oct.
    • Ablefilm 504-1. Technical Data Sheet Oct. 2000, Ablestik Laboratories.
    • (2000) Technical Data Sheet
  • 207
    • 84882171201 scopus 로고    scopus 로고
    • Ablefilm 550
    • Ablestik Laboratories, May
    • Ablefilm 550. Technical Data Sheet May 2001, Ablestik Laboratories.
    • (2001) Technical Data Sheet
  • 212
    • 84902395042 scopus 로고    scopus 로고
    • Evaluating the Effect of Conformal Coatings in Reducing the Rate of Conducive Anodic Filament Formation
    • Jan.
    • Bent W.R., Turbini L.J. Evaluating the Effect of Conformal Coatings in Reducing the Rate of Conducive Anodic Filament Formation. Proc. Apex, San Diego, CA Jan. 2002.
    • (2002) Proc. Apex, San Diego, CA
    • Bent, W.R.1    Turbini, L.J.2
  • 213
    • 84882196272 scopus 로고    scopus 로고
    • Standard Test Method for Kauri-Butanol Value of Hydrocarbon Solvents, ASTM D1133-02, Book of Standards, Vol. 6.04.
    • Standard Test Method for Kauri-Butanol Value of Hydrocarbon Solvents, ASTM D1133-02, Book of Standards, Vol. 6.04.
  • 218
    • 84882094180 scopus 로고    scopus 로고
    • Accel Microcel Product Bulletin 36276
    • Cookson Electronics, Apr.
    • Accel Microcel Product Bulletin 36276. Speedline Technologies Apr. 2000, Cookson Electronics.
    • (2000) Speedline Technologies
  • 219
    • 84882114730 scopus 로고    scopus 로고
    • Critical Cleaning of Flip-Chip Packages Using Dense Phase CO2 Technology
    • Jackson D., Bixenman M. Critical Cleaning of Flip-Chip Packages Using Dense Phase CO2 Technology. Proc. NEPCON West Conf. 2000, 640-649.
    • (2000) Proc. NEPCON West Conf. , pp. 640-649
    • Jackson, D.1    Bixenman, M.2
  • 220
    • 84882186312 scopus 로고    scopus 로고
    • SuperFuge® Liquid and SCF CO2 Cleaning System, Bulletin SF-1000, Deflex Corp. (undated)
    • SuperFuge® Liquid and SCF CO2 Cleaning System, Bulletin SF-1000, Deflex Corp. (undated).
  • 222
    • 5044249163 scopus 로고
    • Surface Preparation for Film and Coating Deposition Processes
    • Noyes Publications, Ch. 3, R.F. Bunshah (Ed.)
    • Mattox D.M. Surface Preparation for Film and Coating Deposition Processes. Handbook of Deposition Technologies for Films and Coatings 1994, Noyes Publications, Ch. 3. 2nd Ed. R.F. Bunshah (Ed.).
    • (1994) Handbook of Deposition Technologies for Films and Coatings
    • Mattox, D.M.1
  • 223
    • 84882195704 scopus 로고    scopus 로고
    • The Use of Plasma for Surface Modification, Glen Technologies Application Note GT-110.
    • The Use of Plasma for Surface Modification, Glen Technologies Application Note GT-110.
  • 224
    • 84882149639 scopus 로고    scopus 로고
    • March Instruments, Dec. 19,
    • Plasma for Cleaning/Etching Dec. 19, 2001, March Instruments. http://www.plasmod.com/ma02001.htm.
    • (2001) Plasma for Cleaning/Etching
  • 225
    • 84882091310 scopus 로고    scopus 로고
    • Private communications with Laura West, Glen Technologies, Div. of Yield Engineering; James Getty, March Instruments; and Samanta Hildreth, Plasma Etch, Inc.
    • Private communications with Laura West, Glen Technologies, Div. of Yield Engineering; James Getty, March Instruments; and Samanta Hildreth, Plasma Etch, Inc.
  • 227
    • 33645659676 scopus 로고    scopus 로고
    • Plasma Processing For Enhanced Underfill
    • Jul.
    • Zhao J., Getty J.D. Plasma Processing For Enhanced Underfill. Chip Scale Review Jul. 2004.
    • (2004) Chip Scale Review
    • Zhao, J.1    Getty, J.D.2
  • 229
    • 84882099529 scopus 로고    scopus 로고
    • Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract (ROSE), Method 2.3.25
    • Feb.
    • Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract (ROSE), Method 2.3.25. IPC-TM-650 Test Methods Manual Feb. 2001.
    • (2001) IPC-TM-650 Test Methods Manual
  • 231
    • 84882091173 scopus 로고
    • Qualification and Performance of Electrical Insulating Compound for Printed Board Assemblies, IPC-9201
    • IPC, IPC-CC-830A (Oct. 1998), Jul.
    • Qualification and Performance of Electrical Insulating Compound for Printed Board Assemblies, IPC-9201. Surface Insulation Resistance Handbook Jul. 1990, IPC, IPC-CC-830A (Oct. 1998).
    • (1990) Surface Insulation Resistance Handbook
  • 232
    • 84882188486 scopus 로고
    • Factors Affecting Insulation Resistance Performance of Printed Circuits
    • Mar.
    • Factors Affecting Insulation Resistance Performance of Printed Circuits. IPC-TR-468 Mar. 1979.
    • (1979) IPC-TR-468
  • 235
    • 0034499484 scopus 로고    scopus 로고
    • SMT Adhesive Deposition: The Line to Success
    • Dec.
    • Fisher E., Hinerman J.B., Dixon D. SMT Adhesive Deposition: The Line to Success. SMT Dec. 2000.
    • (2000) SMT
    • Fisher, E.1    Hinerman, J.B.2    Dixon, D.3
  • 236
    • 84882208131 scopus 로고    scopus 로고
    • Practical Production Applications for Jetting Technology
    • Mar.
    • Piracci A.F. Practical Production Applications for Jetting Technology. APEX Conf., Long Beach, CA Mar. 2000.
    • (2000) APEX Conf., Long Beach, CA
    • Piracci, A.F.1
  • 237
    • 3042867132 scopus 로고    scopus 로고
    • Adhesives/Epoxies and Dispensing
    • May
    • Gilleo K. Adhesives/Epoxies and Dispensing. SMT May 1996.
    • (1996) SMT
    • Gilleo, K.1
  • 238
    • 84882069878 scopus 로고    scopus 로고
    • Selecting the Right Die Attach Adhesives
    • Jul.
    • McCabe J.D. Selecting the Right Die Attach Adhesives. HDI Jul. 2001.
    • (2001) HDI
    • McCabe, J.D.1
  • 241
    • 54849441637 scopus 로고    scopus 로고
    • The State of Stencil Technology
    • Mar.
    • Whitmore M. The State of Stencil Technology. SMT Mar. 2004.
    • (2004) SMT
    • Whitmore, M.1
  • 243
    • 84882116584 scopus 로고    scopus 로고
    • Adhesives Printing in Surface Mount, Dorn SPE Inc. (undated)
    • Adhesives Printing in Surface Mount, Dorn SPE Inc. (undated).
  • 244
    • 0031062082 scopus 로고    scopus 로고
    • Behavior of Adhesives Before Curing
    • Feb.
    • Van den Bosch A. Behavior of Adhesives Before Curing. SMT Feb. 1997.
    • (1997) SMT
    • Van den Bosch, A.1
  • 245
    • 84882093473 scopus 로고    scopus 로고
    • Printing of SMT Adhesives, Heraeus Technical Service Bulletin (undated)
    • Printing of SMT Adhesives, Heraeus Technical Service Bulletin (undated).
  • 246
    • 0346668462 scopus 로고
    • A Practical Approach to Die Attach Adhesive Selection
    • Jun.
    • Estes R. A Practical Approach to Die Attach Adhesive Selection. Hybrid Circuit Technol. Jun. 1991.
    • (1991) Hybrid Circuit Technol.
    • Estes, R.1
  • 247
    • 84882050968 scopus 로고    scopus 로고
    • Henkel-Loctite, Mar.
    • ® Products Mar. 2002, Henkel-Loctite. http://www.loctite.com/electronics/smt_viscosity.html.
    • (2002) reg; Products
  • 248
    • 84882083167 scopus 로고
    • Adhesive Deposition: Pin, Syringe, Stencil
    • Dec.
    • Zarrow P. Adhesive Deposition: Pin, Syringe, Stencil. Circuit Assembly Dec. 1995.
    • (1995) Circuit Assembly
    • Zarrow, P.1
  • 249
    • 17744417051 scopus 로고    scopus 로고
    • SMA Dispensing Trends
    • Jan.
    • Piracci A.F. SMA Dispensing Trends. SMT Jan. 2001.
    • (2001) SMT
    • Piracci, A.F.1
  • 251
    • 84882177745 scopus 로고    scopus 로고
    • (Jan. 23, 2002)
    • (Jan. 23, 2002). http://www.loctite.com/electronics/smt_dispensing.html.
  • 252
    • 84882196700 scopus 로고    scopus 로고
    • Die Attach Adhesives: A Guide to Material Properties and Applications, Technical Paper GB-48, Epoxy Technology Corp.
    • Hannafin, J.J., Pernice, R.F., Estes, R.H., Die Attach Adhesives: A Guide to Material Properties and Applications, Technical Paper GB-48, Epoxy Technology Corp.
    • Hannafin, J.J.1    Pernice, R.F.2    Estes, R.H.3
  • 255
    • 84882184704 scopus 로고    scopus 로고
    • Adhesives/Epoxies and Dispensing: The Building Blocks
    • Jul.
    • Marinelli C., Burns B. Adhesives/Epoxies and Dispensing: The Building Blocks. SMT Special Supplement Jul. 2001.
    • (2001) SMT Special Supplement
    • Marinelli, C.1    Burns, B.2
  • 256
    • 84882139614 scopus 로고
    • The Properties of SMD Adhesives
    • Feb.
    • Gossling M. The Properties of SMD Adhesives. Circuits Assembly Feb. 1994.
    • (1994) Circuits Assembly
    • Gossling, M.1
  • 257
    • 4243748528 scopus 로고    scopus 로고
    • Improved Performance Properties For Adhesives
    • Jul.
    • Williams R.E., Tirpak R.E. Improved Performance Properties For Adhesives. SMT Jul. 1999.
    • (1999) SMT
    • Williams, R.E.1    Tirpak, R.E.2
  • 259
    • 0035410504 scopus 로고    scopus 로고
    • The Dawn of Micro-Dispensing
    • Jul.
    • Peek R. The Dawn of Micro-Dispensing. SMT Jul. 2001.
    • (2001) SMT
    • Peek, R.1
  • 260
    • 84882203688 scopus 로고    scopus 로고
    • The Effects of New Trends in Flip Chip Packages on Automating the Underfill Process
    • Mar.
    • Newbold J., Lewis A. The Effects of New Trends in Flip Chip Packages on Automating the Underfill Process. Proc. NEPCON West, Anaheim, CA Mar. 1998.
    • (1998) Proc. NEPCON West, Anaheim, CA
    • Newbold, J.1    Lewis, A.2
  • 262
    • 84882231472 scopus 로고    scopus 로고
    • Controlling Process Parameters for Flip-Chip Underfill
    • Jul.
    • Lim R., Duck A. Controlling Process Parameters for Flip-Chip Underfill. Electronics Engineer Jul. 2000.
    • (2000) Electronics Engineer
    • Lim, R.1    Duck, A.2
  • 265
    • 84882217128 scopus 로고    scopus 로고
    • Dispensible Adhesive Benchmarking
    • Anaheim, CA
    • Kondo M. Dispensible Adhesive Benchmarking. Proc. NEPCON West Conf. 2000, Anaheim, CA.
    • (2000) Proc. NEPCON West Conf.
    • Kondo, M.1
  • 266
    • 84882145746 scopus 로고    scopus 로고
    • Advantages of Non-Contact Dispensing in SMT Assembly Processes
    • Chicago, IL, Sep.
    • Piracci A.F. Advantages of Non-Contact Dispensing in SMT Assembly Processes. Surface Mount Technology Assoc./ATE Sep. 2000, Chicago, IL.
    • (2000) Surface Mount Technology Assoc./ATE
    • Piracci, A.F.1
  • 267
    • 41049106494 scopus 로고    scopus 로고
    • Jet Dispensing-A Paradigm Shift in Technology
    • Jul.
    • Adamson S.J. Jet Dispensing-A Paradigm Shift in Technology. MEPTEC Report Jul. 2003.
    • (2003) MEPTEC Report
    • Adamson, S.J.1
  • 268
    • 84882057096 scopus 로고    scopus 로고
    • ASL-90-2028, Rev. C, Asymtek Publication (Sep. 2002)
    • ASL-90-2028, Rev. C, Asymtek Publication (Sep. 2002).
  • 270
    • 84882144361 scopus 로고    scopus 로고
    • Chipbonder® 3621, Loctite Technical Data Sheet (Nov. 2001); Epo-Tek® H70E, Revision 2, Epoxy Technology Data Sheet (Mar. 1998); Amicon® E-1330LV, Technical Data Sheet, Emerson & Cuming (Jun. 2000)
    • Chipbonder® 3621, Loctite Technical Data Sheet (Nov. 2001); Epo-Tek® H70E, Revision 2, Epoxy Technology Data Sheet (Mar. 1998); Amicon® E-1330LV, Technical Data Sheet, Emerson & Cuming (Jun. 2000).
  • 271
    • 84882083167 scopus 로고
    • Adhesive Deposition: Pin, Syringe, Stencil
    • Dec.
    • Zarrow P. Adhesive Deposition: Pin, Syringe, Stencil. Circuits Assembly Dec. 1995.
    • (1995) Circuits Assembly
    • Zarrow, P.1
  • 272
    • 84882140813 scopus 로고    scopus 로고
    • Ultra High-Speed Dispensing of Surface Mount Materials to Enhance Production Throughput
    • Long Beach, CA, Mar.
    • Piracci A.F. Ultra High-Speed Dispensing of Surface Mount Materials to Enhance Production Throughput. Proc. APEX Conf. Mar. 2000, Long Beach, CA.
    • (2000) Proc. APEX Conf.
    • Piracci, A.F.1
  • 273
    • 84882094959 scopus 로고    scopus 로고
    • Product Data Sheets for: ESP 7685-HF, TP 7150, TP 7090, ESP 8680-HF, TP 8153, and TP 8093 AI Technologies.
    • Product Data Sheets for: ESP 7685-HF, TP 7150, TP 7090, ESP 8680-HF, TP 8153, and TP 8093 AI Technologies.
  • 274
    • 84882078781 scopus 로고    scopus 로고
    • Step 6- Component Placement
    • Jun.
    • Wischoffer S. Step 6- Component Placement. SMT Jun. 2001.
    • (2001) SMT
    • Wischoffer, S.1
  • 275
    • 84882228599 scopus 로고
    • Determining Corrosion Tendencies of Die-Attach Adhesives Using the Sealed Glass Tube Test
    • Apr.
    • Hunadi R., Bilow N., Noack L. Determining Corrosion Tendencies of Die-Attach Adhesives Using the Sealed Glass Tube Test. Hybrid Circuit Technol. Apr. 1988.
    • (1988) Hybrid Circuit Technol.
    • Hunadi, R.1    Bilow, N.2    Noack, L.3
  • 277
    • 84882058345 scopus 로고    scopus 로고
    • Ablebond® 8509 (Feb. 2001); 84-3 MVB (Nov. 2000); 2025D, 2025, 2000 (Oct. 2000); 8355F (Nov. 2000); 8360 (Nov. 2000); 8510AA (Oct. 2000); 8515 (Nov. 2000); 2100A, 826-IDS (Oct. 2000); 8290 (Jul. 2001); 8322A (Jul. 2001); 8361 (Jul. 2001), Technical Data Sheets, Ablestik Laboratories.
    • Ablebond® 8509 (Feb. 2001); 84-3 MVB (Nov. 2000); 2025D, 2025, 2000 (Oct. 2000); 8355F (Nov. 2000); 8360 (Nov. 2000); 8510AA (Oct. 2000); 8515 (Nov. 2000); 2100A, 826-IDS (Oct. 2000); 8290 (Jul. 2001); 8322A (Jul. 2001); 8361 (Jul. 2001), Technical Data Sheets, Ablestik Laboratories.
  • 278
    • 84882174132 scopus 로고    scopus 로고
    • Dymax® 9-20365, 9-20366, and 9-20367, Dymax Technical Data Sheets.
    • Dymax® 9-20365, 9-20366, and 9-20367, Dymax Technical Data Sheets.
  • 280
    • 0022698857 scopus 로고
    • Portable Ultraviolet System Provides High Intensity Cures
    • Apr.
    • Schick S. Portable Ultraviolet System Provides High Intensity Cures. Adhesives Age Apr. 1986.
    • (1986) Adhesives Age
    • Schick, S.1
  • 281
    • 0008158470 scopus 로고    scopus 로고
    • Innovative Curing of High Reliability Advanced Polymeric Encapsulants
    • Fathi Z., et al. Innovative Curing of High Reliability Advanced Polymeric Encapsulants. Proc. NEPCON West 1998.
    • (1998) Proc. NEPCON West
    • Fathi, Z.1
  • 282
    • 84882060427 scopus 로고    scopus 로고
    • Comparison of Die Level Stresses in Chip-on-Board Packages Processed with Conventional and VFM Encapsulant Curing
    • Denver, CO, Apr.
    • Zou Y., Harris J., Ahmad I., Tucker D., Fathi Z. Comparison of Die Level Stresses in Chip-on-Board Packages Processed with Conventional and VFM Encapsulant Curing. Proc. High Density Packaging and MCM Conf. Apr. 1999, Denver, CO.
    • (1999) Proc. High Density Packaging and MCM Conf.
    • Zou, Y.1    Harris, J.2    Ahmad, I.3    Tucker, D.4    Fathi, Z.5
  • 283
    • 0005309432 scopus 로고    scopus 로고
    • Determination of Curing Schedule for Advanced Packaging Materials
    • 4th Quarter
    • Chen Y., Chew F., Goodwin C. Determination of Curing Schedule for Advanced Packaging Materials. Intl. J. Microcircuits and Electronic Packaging 4th Quarter 1997, 20(4):540-544.
    • (1997) Intl. J. Microcircuits and Electronic Packaging , vol.20 , Issue.4 , pp. 540-544
    • Chen, Y.1    Chew, F.2    Goodwin, C.3
  • 284
    • 84882142000 scopus 로고    scopus 로고
    • Effects of Processing Parameters on the Performance of Epoxy Encapsulant Materials
    • Dec.
    • Naito C.M., Todd M. Effects of Processing Parameters on the Performance of Epoxy Encapsulant Materials. Dexter Technical Paper Dec. 2000.
    • (2000) Dexter Technical Paper
    • Naito, C.M.1    Todd, M.2
  • 289
    • 0024170119 scopus 로고
    • Adhesive Bonding Hybrid Microcircuit Substrates with a Thermoplastic Film
    • Apr.
    • Shores A.A. Adhesive Bonding Hybrid Microcircuit Substrates with a Thermoplastic Film. SAMPE Quarterly Apr. 1988, 19.
    • (1988) SAMPE Quarterly , pp. 19
    • Shores, A.A.1
  • 291
    • 84882105077 scopus 로고    scopus 로고
    • Reworking Underfilled Flip-chips, Semiconductor Equipment Corp., Moorpark, CA.
    • Moore, D., Studley, G., Reworking Underfilled Flip-chips, Semiconductor Equipment Corp., Moorpark, CA.
    • Moore, D.1    Studley, G.2
  • 293
    • 0034499484 scopus 로고    scopus 로고
    • SMT Adhesive Deposition: The Line to Success
    • Dec.
    • Fisher E., Hinerman F, Dixon D. SMT Adhesive Deposition: The Line to Success. SMT Dec. 2000.
    • (2000) SMT
    • Fisher, E.1    Hinerman, F.2    Dixon, D.3
  • 295
    • 84882072892 scopus 로고    scopus 로고
    • Siemens AG, Berlin, SN59651, Sep.
    • Adhesives for SMD Technology Sep. 1997, Siemens AG, Berlin, SN59651. Edition 997-09.
    • (1997) Adhesives for SMD Technology
  • 296
    • 84882111911 scopus 로고    scopus 로고
    • Adhesives, Epoxies and Dispensing
    • May
    • Burns B., Fisher E. Adhesives, Epoxies and Dispensing. SMT May 2001.
    • (2001) SMT
    • Burns, B.1    Fisher, E.2
  • 297
    • 84882120384 scopus 로고    scopus 로고
    • SMT Adhesives.Evaluating the Materials Critical Parameters
    • Jul.
    • Beckman S., et al. SMT Adhesives.Evaluating the Materials Critical Parameters. SMT Jul. 1997.
    • (1997) SMT
    • Beckman, S.1
  • 298
    • 0031062082 scopus 로고    scopus 로고
    • Behavior of Adhesives Before Curing
    • Feb.
    • Van den Bosch A. Behavior of Adhesives Before Curing. SMT Feb. 1997.
    • (1997) SMT
    • Van den Bosch, A.1
  • 299
    • 84882231881 scopus 로고    scopus 로고
    • QMI-3555R, Loctite Technical Data Sheet (revised Jan.2000)
    • QMI-3555R, Loctite Technical Data Sheet (revised Jan.2000).
  • 301
    • 84882184589 scopus 로고
    • Manufacturing Technology For VLSIC Packaging
    • Navy Contract N66001-88-C-0181, Jun. 28,
    • Manufacturing Technology For VLSIC Packaging. Hughes Aircraft Final Report Jun. 28, 1993, Navy Contract N66001-88-C-0181.
    • (1993) Hughes Aircraft Final Report
  • 302
    • 84882221743 scopus 로고    scopus 로고
    • Flip-Chip Underfill: Design and Material Challenges
    • Jan./Feb.
    • Tonapi S., Reitz B. Flip-Chip Underfill: Design and Material Challenges. Chip Scale Review Jan./Feb. 2004.
    • (2004) Chip Scale Review
    • Tonapi, S.1    Reitz, B.2
  • 303
    • 84882226018 scopus 로고    scopus 로고
    • Material Safety Data Sheet 1755-E-1330LV, Amicon E-1330LV
    • Emerson & Cuming, Dec.
    • Material Safety Data Sheet 1755-E-1330LV, Amicon E-1330LV. Document 800063 Dec. 2000, Emerson & Cuming.
    • (2000) Document 800063
  • 304
    • 84882123334 scopus 로고    scopus 로고
    • No-Flow Fluxing Underfill Material and Process Considerations
    • Katze D. No-Flow Fluxing Underfill Material and Process Considerations. Proc. HDI Conf. 2000.
    • (2000) Proc. HDI Conf.
    • Katze, D.1
  • 305
    • 84882096006 scopus 로고    scopus 로고
    • Achieving SMT Compatible Flip-Chip Assembly with No-Flow Underfills
    • Anaheim, CA
    • DeBarros T., Katze D. Achieving SMT Compatible Flip-Chip Assembly with No-Flow Underfills. Proc. NEPCON West Conf. 2000, Anaheim, CA.
    • (2000) Proc. NEPCON West Conf.
    • DeBarros, T.1    Katze, D.2
  • 306
    • 84882231472 scopus 로고    scopus 로고
    • Controlling Process Parameters for Flip-Chip Underfill
    • Jul.
    • Lim R., Duck A. Controlling Process Parameters for Flip-Chip Underfill. Electronics Engineer Jul. 2000.
    • (2000) Electronics Engineer
    • Lim, R.1    Duck, A.2
  • 307
    • 84882143936 scopus 로고    scopus 로고
    • Bump Types, Metallization and Substrate Considerations
    • Oct.
    • Patterson T., Esfandiar F. Bump Types, Metallization and Substrate Considerations. HDI Oct. 1999.
    • (1999) HDI
    • Patterson, T.1    Esfandiar, F.2
  • 310
    • 84882079208 scopus 로고    scopus 로고
    • Wafer-Level Processing, Variations on a Theme
    • Sep.
    • Korczynski E. Wafer-Level Processing, Variations on a Theme. Semiconductor Magazine Sep. 2002, 5(9).
    • (2002) Semiconductor Magazine , vol.5 , Issue.9
    • Korczynski, E.1
  • 311
    • 84882133131 scopus 로고    scopus 로고
    • Continued Improvements in the Use of Alloys and Polymers to Enhance Wafer-Level IC Performance
    • Oct.
    • Patterson D.S. Continued Improvements in the Use of Alloys and Polymers to Enhance Wafer-Level IC Performance. Chip Scale Review Oct. 2002.
    • (2002) Chip Scale Review
    • Patterson, D.S.1
  • 313
    • 84882192314 scopus 로고    scopus 로고
    • Environmental Test Methods and Engineering Guidelines, MIL-STD-810.
    • Environmental Test Methods and Engineering Guidelines, MIL-STD-810.
  • 314
    • 84882169248 scopus 로고    scopus 로고
    • Electronic and Electrical Component Parts
    • MIL-STD-202, Feb.
    • Electronic and Electrical Component Parts. Test Method Standard Feb. 2002, MIL-STD-202.
    • (2002) Test Method Standard
  • 315
    • 84882136986 scopus 로고    scopus 로고
    • Hybrid Microcircuits, Performance Specification, General Specification, MIL-PRF-38534.
    • Hybrid Microcircuits, Performance Specification, General Specification, MIL-PRF-38534.
  • 317
    • 84882212597 scopus 로고    scopus 로고
    • Outgassing Data for Selecting Spacecraft Materials
    • Rev. 4, Goddard Space Flight Center, Jun.
    • Outgassing Data for Selecting Spacecraft Materials. NASA Reference Publication 1124 Jun. 1997, Rev. 4, Goddard Space Flight Center. http://www.outgassing.nasa.gov.
    • (1997) NASA Reference Publication 1124
  • 321
    • 84882071146 scopus 로고    scopus 로고
    • Guidance on Selection of Tests, ISO 10993, International Organization for Standardization.
    • Guidance on Selection of Tests, ISO 10993, International Organization for Standardization.
  • 324
    • 84882176704 scopus 로고    scopus 로고
    • Let's Talk Chip Scale
    • IPC Supplement, Apr.
    • Bauer C.E. Let's Talk Chip Scale. Circuits Assembly Apr. 1997, IPC Supplement.
    • (1997) Circuits Assembly
    • Bauer, C.E.1
  • 325
    • 9744251619 scopus 로고    scopus 로고
    • Chip Scale vs Flip Chip: Issues to Consider
    • Nov.
    • Ngulty T.A., Ekere N.N. Chip Scale vs Flip Chip: Issues to Consider. Circuits Assembly Nov. 1999.
    • (1999) Circuits Assembly
    • Ngulty, T.A.1    Ekere, N.N.2
  • 327
    • 12944317214 scopus 로고    scopus 로고
    • High-Density Packaging: The Next Interconnect Challenge
    • Feb.
    • Baliga J. High-Density Packaging: The Next Interconnect Challenge. Semiconductor Intl. Feb. 2000, 91-94.
    • (2000) Semiconductor Intl. , pp. 91-94
    • Baliga, J.1
  • 328
    • 0035390620 scopus 로고    scopus 로고
    • Advantages of System on a Package and System on a Chip
    • Jul.
    • Karnezas M. Advantages of System on a Package and System on a Chip. Electronic Packaging and Production Jul. 2001.
    • (2001) Electronic Packaging and Production
    • Karnezas, M.1
  • 329
    • 14844336217 scopus 로고    scopus 로고
    • 3-D Packaging for Wireless Applications
    • Feb.
    • Miles B., et al. 3-D Packaging for Wireless Applications. Semiconductor Intl. Feb. 2004.
    • (2004) Semiconductor Intl.
    • Miles, B.1
  • 330
    • 84882142307 scopus 로고    scopus 로고
    • What.s New in Packaging
    • May
    • McCray E. What.s New in Packaging. HDI May 2001.
    • (2001) HDI
    • McCray, E.1
  • 332
    • 84882133570 scopus 로고    scopus 로고
    • Entering a New Era, Cubic Memory Brochure, Cubic Memory (now Vertical Circuits, Inc.).
    • Entering a New Era, Cubic Memory Brochure, Cubic Memory (now Vertical Circuits, Inc.).
  • 337
    • 84882207799 scopus 로고    scopus 로고
    • ARclad®, Adhesives Research, Inc.
    • ARclad®, Adhesives Research, Inc.
  • 338
    • 84882119006 scopus 로고    scopus 로고
    • CL-130 Adhesive on Cho-Seal S6305
    • Div. of Parker Hannifin Corp. Aug.
    • CL-130 Adhesive on Cho-Seal S6305. Test Report # CHO-TR CL130, Chomerics Aug. 2001, Div. of Parker Hannifin Corp.
    • (2001) Test Report # CHO-TR CL130, Chomerics
  • 341
    • 0005783439 scopus 로고    scopus 로고
    • Liu J., et al. ECTC Proc. 2000, 975-980.
    • (2000) ECTC Proc. , pp. 975-980
    • Liu, J.1
  • 342
    • 0009635217 scopus 로고    scopus 로고
    • Packaging of Fiber Collimators
    • Jan.
    • Zhou H., et al. Packaging of Fiber Collimators. Advanced Packaging Jan. 2002.
    • (2002) Advanced Packaging
    • Zhou, H.1
  • 343
    • 0034479490 scopus 로고    scopus 로고
    • Comparison of Active and Passive Fiber Alignment Techniques for Multimode Laser Pigtailing
    • Las Vegas, NV, May
    • Karioja P., et al. Comparison of Active and Passive Fiber Alignment Techniques for Multimode Laser Pigtailing. Proc. 50th Electronic Components and Technology Conf. May 2000, Las Vegas, NV.
    • (2000) Proc. 50th Electronic Components and Technology Conf.
    • Karioja, P.1
  • 345
    • 84882213468 scopus 로고    scopus 로고
    • Lid Sealing Epoxy Technical Data Sheet, EpoTek H77, Epoxy Technology, Billerica, MA
    • Lid Sealing Epoxy Technical Data Sheet, EpoTek H77, Epoxy Technology, Billerica, MA.
  • 346
    • 84882168678 scopus 로고    scopus 로고
    • Rockwell Collins Radio, Internal Evaluation (ca.1975)
    • Rockwell Collins Radio, Internal Evaluation (ca.1975).
  • 347
    • 0017424194 scopus 로고
    • Development of Low-Cost, High-Reliability Sealing Techniques for Hybrid Microcircuit Packages
    • Aug.
    • Perkins K.L., Licari J.J. Development of Low-Cost, High-Reliability Sealing Techniques for Hybrid Microcircuit Packages. Final Report, NASA, NAS-831992 Aug. 1977.
    • (1977) Final Report, NASA, NAS-831992
    • Perkins, K.L.1    Licari, J.J.2
  • 348
    • 84882145542 scopus 로고    scopus 로고
    • Epoxies for OptoElectronic Packaging: Applications and Material Properties
    • IMAPS, Second Quarter
    • Hodgin M.J. Epoxies for OptoElectronic Packaging: Applications and Material Properties. J. Microelectronics and Electronic Packaging Second Quarter 2004, 1(2). IMAPS.
    • (2004) J. Microelectronics and Electronic Packaging , vol.1 , Issue.2
    • Hodgin, M.J.1
  • 349
    • 84882097833 scopus 로고    scopus 로고
    • reg; 2600BT
    • Ablestik Laboratories, Sep.
    • ® 2600BT. Technical Data Sheet Sep. 2003, Ablestik Laboratories.
    • (2003) Technical Data Sheet
  • 350
    • 84882061093 scopus 로고    scopus 로고
    • QMI-9503
    • Henkel Loctite, Apr.
    • QMI-9503. Technical Data Sheet Apr.2003, Henkel Loctite.
    • (2003) Technical Data Sheet
  • 351
    • 84882103109 scopus 로고
    • Die Attach Epoxy.s Role in Thin-Package Delamination
    • Jul.
    • Comstock R. Die Attach Epoxy.s Role in Thin-Package Delamination. Semiconductor Intl. Jul. 1993.
    • (1993) Semiconductor Intl.
    • Comstock, R.1
  • 352
    • 84882135103 scopus 로고    scopus 로고
    • The Use of Commercial Components in a High Reliability Environment
    • Nov.
    • Britt L. The Use of Commercial Components in a High Reliability Environment. Surface Mount Technology Nov. 2000.
    • (2000) Surface Mount Technology
    • Britt, L.1
  • 353
    • 84882197046 scopus 로고
    • Low-Stress Adhesive
    • Winter
    • Loh K. Low-Stress Adhesive. Advanced Packaging Winter 1993.
    • (1993) Advanced Packaging
    • Loh, K.1
  • 355
  • 356
    • 0021651323 scopus 로고
    • Die Attach in Hi-Rel PDIPs: Polyimide or Low Chloride Epoxies
    • Mooney C.T., Bolger J. Die Attach in Hi-Rel PDIPs: Polyimide or Low Chloride Epoxies. IEEE Trans. 1984.
    • (1984) IEEE Trans.
    • Mooney, C.T.1    Bolger, J.2
  • 358
    • 84882065962 scopus 로고    scopus 로고
    • Stress Effects of Epoxy Adhesives on Ceramic Substrates and Magnetics
    • Swanson D.W., Enlow L.R. Stress Effects of Epoxy Adhesives on Ceramic Substrates and Magnetics. Proc. IMAPS Conf. 1999.
    • (1999) Proc. IMAPS Conf.
    • Swanson, D.W.1    Enlow, L.R.2
  • 359
    • 0035310644 scopus 로고    scopus 로고
    • Stress Effects of Epoxy Adhesives on Ceramic Substrates and Magnetics
    • Swanson D.W., Enlow L.R. Stress Effects of Epoxy Adhesives on Ceramic Substrates and Magnetics. Microelectronics Reliability 2001, 41:499-510.
    • (2001) Microelectronics Reliability , vol.41 , pp. 499-510
    • Swanson, D.W.1    Enlow, L.R.2
  • 361
    • 84882084333 scopus 로고    scopus 로고
    • Failure Analysis for Area-Array Packages
    • Sep.
    • Anson S.J. Failure Analysis for Area-Array Packages. High Density Interconnect Sep. 2001.
    • (2001) High Density Interconnect
    • Anson, S.J.1
  • 363
    • 84882136713 scopus 로고    scopus 로고
    • Abletherm 2600 Series Adhesives
    • Ablestik Labs.Nov.
    • Abletherm 2600 Series Adhesives. Processing Tip Sheet Nov. 1999, Ablestik Labs.
    • (1999) Processing Tip Sheet
  • 364
    • 84882173104 scopus 로고    scopus 로고
    • Self Shimming Thermally Conductive Adhesive Multi-Cure 9-20699
    • Apr.
    • Self Shimming Thermally Conductive Adhesive Multi-Cure 9-20699. Preliminary Product Data Sheet, Dymax Corp. Apr. 2004.
    • (2004) Preliminary Product Data Sheet, Dymax Corp.
  • 366
    • 0021541964 scopus 로고
    • Polymeric Materials and the New MIL-SPECS- A Hybrid Users View
    • Ebel G.H., Engelke H.A. Polymeric Materials and the New MIL-SPECS- A Hybrid Users View. Proc. ISHM 1984, 189-193.
    • (1984) Proc. ISHM , pp. 189-193
    • Ebel, G.H.1    Engelke, H.A.2
  • 367
    • 0021589930 scopus 로고
    • Adhesive Related Failure Mechanisms in Military Hybrid Packages
    • Dec.
    • Bolger J. Adhesive Related Failure Mechanisms in Military Hybrid Packages. Intl. J. Hybrid Microelectronics Dec. 1984.
    • (1984) Intl. J. Hybrid Microelectronics
    • Bolger, J.1
  • 372
    • 0033295041 scopus 로고    scopus 로고
    • Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
    • Sep.
    • Lu D., Wong C.P. Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems. J. Electronics Mfg. Sep. 1999, 9(3):223-232.
    • (1999) J. Electronics Mfg. , vol.9 , Issue.3 , pp. 223-232
    • Lu, D.1    Wong, C.P.2
  • 374
    • 84882223117 scopus 로고    scopus 로고
    • Peculiar Behavior of Electrically Conductive Adhesives on Aluminum Surfaces, Ablestik Laboratories (undated)
    • Kraus, H.S., Peculiar Behavior of Electrically Conductive Adhesives on Aluminum Surfaces, Ablestik Laboratories (undated).
    • Kraus, H.S.1
  • 378
    • 0022214080 scopus 로고
    • Electronic Grade Adhesives, Reliability and Performance
    • Mooney C.T. Electronic Grade Adhesives, Reliability and Performance. Proc. 35th Electronic Components Conf. 1985, 326-330.
    • (1985) Proc. 35th Electronic Components Conf. , pp. 326-330
    • Mooney, C.T.1
  • 379
    • 0005422683 scopus 로고    scopus 로고
    • High Density, Low-Mass Hybrid and Associated Technologies
    • Japan Institute of Electronic Packaging (JIEP); Dictionary of Electronic Packaging Technology, ISBN:4-7693-7089-X 63555, Sep.
    • Unno Y. High Density, Low-Mass Hybrid and Associated Technologies. Proc. 6th Workshop on Electronics for LHC Experiments, Krakow, Poland Sep. 2000, Japan Institute of Electronic Packaging (JIEP); Dictionary of Electronic Packaging Technology, ISBN:4-7693-7089-X 63555.
    • (2000) Proc. 6th Workshop on Electronics for LHC Experiments, Krakow, Poland
    • Unno, Y.1
  • 382
    • 0019707260 scopus 로고
    • Material Selection and Design Guidelines for Migration-Resistant Thick-Film Circuits with Silver-Bearing Conductors
    • Riemer D.E. Material Selection and Design Guidelines for Migration-Resistant Thick-Film Circuits with Silver-Bearing Conductors. Proc. 31st Elect. Components Conf. 1981.
    • (1981) Proc. 31st Elect. Components Conf.
    • Riemer, D.E.1
  • 384
  • 386
    • 84882096979 scopus 로고    scopus 로고
    • Particle Impact Noise Detection Test, MIL-STD-883, Method 2020.7.
    • Particle Impact Noise Detection Test, MIL-STD-883, Method 2020.7.
  • 387
    • 84882102713 scopus 로고
    • Qualification of Dow Corning Q3-6527 as a Particle Getter
    • King J. Qualification of Dow Corning Q3-6527 as a Particle Getter. Singer Internal Report YS57A834 1985.
    • (1985) Singer Internal Report YS57A834
    • King, J.1
  • 388
    • 84882057443 scopus 로고
    • Use of Silicone Gel Particle Getters for Microcircuit Packaging
    • Use of Silicone Gel Particle Getters for Microcircuit Packaging. Proc. ISHM 1985.
    • (1985) Proc. ISHM
  • 389
    • 84882212597 scopus 로고    scopus 로고
    • Outgassing Data for Selecting Spacecraft Materials
    • Goddard Space Flight Center,Jun.
    • Outgassing Data for Selecting Spacecraft Materials. NASA Reference Publication 1124, Rev. 4 Jun. 1997, Goddard Space Flight Center. http://www.outgassing.nasa.gov.
    • (1997) NASA Reference Publication 1124, Rev. 4
  • 392
    • 84882108916 scopus 로고    scopus 로고
    • Adhesives for SMD Technology, Siemens Standard SN 59651, (Ed. 1997-09)
    • Adhesives for SMD Technology, Siemens Standard SN 59651, (Ed. 1997-09).
  • 396
    • 84882071163 scopus 로고    scopus 로고
    • Loctite 3607 (Oct. 1995); Loctite 3610 (Nov. 1998); Loctite 3612 (Nov. 1996); Loctite 3614 (Nov. 1996); Technical Data Sheets, Henkel Loctite.
    • Loctite 3607 (Oct. 1995); Loctite 3610 (Nov. 1998); Loctite 3612 (Nov. 1996); Loctite 3614 (Nov. 1996); Technical Data Sheets, Henkel Loctite.
  • 398
    • 84882206139 scopus 로고    scopus 로고
    • Epibond 7002 and Epibond 7200
    • Vantico, Inc. (formerly Furane),Feb.
    • Epibond 7002 and Epibond 7200. Technical Data Sheets Feb. 2001, Vantico, Inc. (formerly Furane).
    • (2001) Technical Data Sheets
  • 399
    • 84882160304 scopus 로고    scopus 로고
    • Hysol KO110 Die-Attach Adhesive, Technical Data Sheets Henkel Loctite.
    • Hysol KO110 Die-Attach Adhesive, Technical Data Sheets Henkel Loctite.
  • 400
    • 84882224187 scopus 로고    scopus 로고
    • Thermoset DS MD-110
    • Thermoset Lord Chemical Products,Apr.
    • Thermoset DS MD-110. Technical Data Sheet Apr. 1999, Thermoset Lord Chemical Products.
    • (1999) Technical Data Sheet
  • 401
    • 84882192241 scopus 로고    scopus 로고
    • Hysol FP 4652
    • Henkel Loctite,Feb.
    • Hysol FP 4652. Technical Data Sheet Feb. 1999, Henkel Loctite.
    • (1999) Technical Data Sheet
  • 402
    • 84882058416 scopus 로고    scopus 로고
    • Hysol FP 4460
    • Henkel Loctite,Sept.
    • Hysol FP 4460. Technical Data Sheet Sept. 1998, Henkel Loctite.
    • (1998) Technical Data Sheet
  • 403
    • 84882192848 scopus 로고    scopus 로고
    • Hysol KO120
    • Henkel Loctite,Apr.
    • Hysol KO120. Technical Data Sheet Apr. 1999, Henkel Loctite.
    • (1999) Technical Data Sheet
  • 404
    • 84882053693 scopus 로고
    • Rheology of Silver Filled Glass Die Attach Adhesive for High Speed Automatic Processing
    • Proc. 37th Electronic Components Conference,May 11.13,
    • Bell G.C., Rosell C.M., Josline S.T. Rheology of Silver Filled Glass Die Attach Adhesive for High Speed Automatic Processing. Du Pont Semiconductor Materials May 11.13, 1987, Proc. 37th Electronic Components Conference.
    • (1987) Du Pont Semiconductor Materials
    • Bell, G.C.1    Rosell, C.M.2    Josline, S.T.3
  • 406
    • 0003810757 scopus 로고    scopus 로고
    • Standard Test Method for Density of Adhesives in Fluid Form
    • ASTM D1875
    • Standard Test Method for Density of Adhesives in Fluid Form. Am. Soc. Testing and Mater. 2003, ASTM D1875.
    • (2003) Am. Soc. Testing and Mater.
  • 407
    • 20444444255 scopus 로고    scopus 로고
    • Standard Test Method for Density and Specific Gravity (Relative Density) of Plastics by Displacement
    • ASTM D792, Dec. 12,
    • Standard Test Method for Density and Specific Gravity (Relative Density) of Plastics by Displacement. Am. Soc. Testing and Mater. Dec. 12, 2000, ASTM D792.
    • (2000) Am. Soc. Testing and Mater.
  • 409
    • 84882064268 scopus 로고    scopus 로고
    • MIL-STD-883F, Method 2017, Internal Visual (Monolithic), Method 2010.11 (Jun. 2004),Jun.
    • Internal Visual (Hybrid) Jun. 2004, MIL-STD-883F, Method 2017, Internal Visual (Monolithic), Method 2010.11 (Jun. 2004).
    • (2004) Internal Visual (Hybrid)
  • 410
    • 0242440426 scopus 로고    scopus 로고
    • Standard Test Method for Haze and Luminous Transmittance of Transparent Plastics
    • ASTM D1003-00, Oct. 6,
    • Standard Test Method for Haze and Luminous Transmittance of Transparent Plastics. Am. Soc. Testing and Mater. Oct. 6, 2000, ASTM D1003-00.
    • (2000) Am. Soc. Testing and Mater.
  • 411
    • 84882052034 scopus 로고    scopus 로고
    • Dymax OP-30 and OP-32, Technical Data Sheets, Dymax Inc.
    • Dymax OP-30 and OP-32, Technical Data Sheets, Dymax Inc.
  • 412
    • 0242440426 scopus 로고    scopus 로고
    • Standard Test Method for Index of Refraction of Transparent Organic Plastics
    • ASTM D542, Oct. 11,
    • Standard Test Method for Index of Refraction of Transparent Organic Plastics. Am. Soc. Testing and Mater. Oct. 11, 2000, ASTM D542.
    • (2000) Am. Soc. Testing and Mater.
  • 414
    • 0003849028 scopus 로고    scopus 로고
    • Standard Test Method for AC Loss Characteristics and Dielectric Constant (Permittivity) of Solid Electrical Insulating Materials
    • ASTM D150
    • Standard Test Method for AC Loss Characteristics and Dielectric Constant (Permittivity) of Solid Electrical Insulating Materials. Am. Soc. Testing and Mater. 2004, ASTM D150.
    • (2004) Am. Soc. Testing and Mater.
  • 417
    • 84882233855 scopus 로고
    • Ablestik Laboratories, a National Starch and Chemical Company, Method TM-PT-15, Sep. 15,
    • Bond Joint Resistance Test Sep. 15, 1993, Ablestik Laboratories, a National Starch and Chemical Company, Method TM-PT-15.
    • (1993) Bond Joint Resistance Test
  • 418
    • 4243718150 scopus 로고    scopus 로고
    • Standard Test Method for Silver Migration for Membrane Switch Circuitry
    • ASTM F1996-01
    • Standard Test Method for Silver Migration for Membrane Switch Circuitry. Am. Soc. Testing and Mater. 2003, ASTM F1996-01.
    • (2003) Am. Soc. Testing and Mater.
  • 419
    • 84882113849 scopus 로고
    • Specification for the Selection and Use of Organic Adhesives in Hybrid Microcircuits
    • (now inactivated), Sep. 9,
    • Specification for the Selection and Use of Organic Adhesives in Hybrid Microcircuits. NASA MSFC-SPEC-592 Sep. 9, 1982, (now inactivated).
    • (1982) NASA MSFC-SPEC-592
  • 420
    • 84882088163 scopus 로고
    • Selection and Control of Plastics for Semiconductor Packaging, Information Microelectronics
    • U.S. Naval Ammunition Depot, Crane, IN, Aug.
    • Licari J.J. Selection and Control of Plastics for Semiconductor Packaging, Information Microelectronics. Navy Equipment μNotes 25 Aug. 1968, U.S. Naval Ammunition Depot, Crane, IN.
    • (1968) Navy Equipment mu;Notes 25
    • Licari, J.J.1
  • 421
    • 84882078213 scopus 로고
    • Standard Test Method for Exposure of Adhesive Specimens to High-Energy Radiation
    • ASTM D1879, Oct. 10,
    • Standard Test Method for Exposure of Adhesive Specimens to High-Energy Radiation. Am. Soc. Testing and Mater. Oct. 10, 1988, ASTM D1879.
    • (1988) Am. Soc. Testing and Mater.
  • 423
    • 84882114043 scopus 로고    scopus 로고
    • Test Methods Manual, IPC-TM-650, Institute for Interconnecting and Packaging Electronic Circuits.
    • Test Methods Manual, IPC-TM-650, Institute for Interconnecting and Packaging Electronic Circuits.
  • 424
    • 84882191771 scopus 로고    scopus 로고
    • Standard Test Method for Water Absorption of Plastics, ASTM D570, Am. Soc. Testing and Mater.
    • Standard Test Method for Water Absorption of Plastics, ASTM D570, Am. Soc. Testing and Mater.
  • 425
    • 20444444255 scopus 로고    scopus 로고
    • Standard Test Method for Gel Time and Peak Exothermic Temperature of Reacting Themosetting Resins
    • ASTM D2471, Oct. 11,
    • Standard Test Method for Gel Time and Peak Exothermic Temperature of Reacting Themosetting Resins. Am. Soc. Testing and Mater. Oct. 11,1999, ASTM D2471.
    • (1999) Am. Soc. Testing and Mater.
  • 427
    • 25044446019 scopus 로고
    • Differential Thermal Analysis
    • Murphy C.B. Differential Thermal Analysis. Anal. Chem. 1960, 32:168R-171R.
    • (1960) Anal. Chem. , vol.32
    • Murphy, C.B.1
  • 428
    • 33947477593 scopus 로고    scopus 로고
    • Differential Thermal Analysis
    • Murphy, C.B., Differential Thermal Analysis, Anal. Chem, 34, 298R-330R.
    • Anal. Chem , vol.34
    • Murphy, C.B.1
  • 429
    • 0003849028 scopus 로고    scopus 로고
    • Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Guarded Hot-Plate Apparatus
    • ASTM C177, Jan. 11,
    • Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Guarded Hot-Plate Apparatus. Am. Soc. Testing and Mater. Jan. 11, 2004, ASTM C177.
    • (2004) Am. Soc. Testing and Mater.
  • 430
    • 0039655475 scopus 로고
    • Thermal Conductivity of Polymers
    • Anderson D.R. Thermal Conductivity of Polymers. Chem. Rev. 1966, 66.
    • (1966) Chem. Rev. , vol.66
    • Anderson, D.R.1
  • 431
    • 84882209656 scopus 로고    scopus 로고
    • Standard Test Method for Steady-State Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus, ASTM C518, Am. Soc. Testing and Mater.
    • Standard Test Method for Steady-State Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus, ASTM C518, Am. Soc. Testing and Mater.
  • 432
    • 0003810757 scopus 로고    scopus 로고
    • Standard Test Method for Thermal Diffusivity of Solids by the Flash Method
    • ASTM E1461, Oct, 2,
    • Standard Test Method for Thermal Diffusivity of Solids by the Flash Method. Am. Soc. Testing and Mater. Oct, 2, 2001, ASTM E1461.
    • (2001) Am. Soc. Testing and Mater.
  • 433
    • 0033225564 scopus 로고    scopus 로고
    • Evaluation of the Thermal Oxidative Stability of Polyimides via TGA Techniques, Part A, Polymer Chemistry
    • Turk M.J., Ansari A.S., Alston W.B., Gahn G.S., Frimer A.A., Schieman D.A. Evaluation of the Thermal Oxidative Stability of Polyimides via TGA Techniques, Part A, Polymer Chemistry. J. Polymer Sci. 1999, 37.
    • (1999) J. Polymer Sci. , vol.37
    • Turk, M.J.1    Ansari, A.S.2    Alston, W.B.3    Gahn, G.S.4    Frimer, A.A.5    Schieman, D.A.6
  • 434
    • 20444444255 scopus 로고    scopus 로고
    • Standard Test Method for Rapid Thermal Degradation of Solid Electrical Insulating Materials By Thermogravimetric Method
    • ASTM D3850
    • Standard Test Method for Rapid Thermal Degradation of Solid Electrical Insulating Materials By Thermogravimetric Method. Am. Soc. Testing and Mater. 2000, ASTM D3850.
    • (2000) Am. Soc. Testing and Mater.
  • 435
    • 0003849028 scopus 로고    scopus 로고
    • Standard Test Method for Rubber Property - Durometer Hardness
    • ASTM D2240, Jan. 7,
    • Standard Test Method for Rubber Property - Durometer Hardness. Am. Soc. Testing and Mater. Jan. 7, 2004, ASTM D2240.
    • (2004) Am. Soc. Testing and Mater.
  • 436
    • 0342737585 scopus 로고    scopus 로고
    • Standard Test Method for Flexural Properties of Unreinforced and Reinforced Plastics and Electrical Insulating Materials
    • ASTM D790, Jan. 3,
    • Standard Test Method for Flexural Properties of Unreinforced and Reinforced Plastics and Electrical Insulating Materials. Am. Soc. Testing and Mater. Jan. 3, 2003, ASTM D790.
    • (2003) Am. Soc. Testing and Mater.
  • 437
    • 0003810757 scopus 로고    scopus 로고
    • Standard Test Method for Tensile Properties of Plastics (Metric)
    • ASTM D638, Jan. 12,
    • Standard Test Method for Tensile Properties of Plastics (Metric). Am. Soc. Testing and Mater. Jan. 12, 2003, ASTM D638.
    • (2003) Am. Soc. Testing and Mater.
  • 438
    • 0242440426 scopus 로고    scopus 로고
    • Standard Test Method for Coefficient of Linear Thermal Expansion of Electrical Insulating Materials
    • ASTM D3386, Oct. 12,
    • Standard Test Method for Coefficient of Linear Thermal Expansion of Electrical Insulating Materials. Am. Soc. Testing and Mater. Oct. 12, 2000, ASTM D3386.
    • (2000) Am. Soc. Testing and Mater.
  • 439
    • 0003810757 scopus 로고    scopus 로고
    • Standard Test Method for Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tension Loading (Metal-to-Metal)
    • ASTM D1002, Oct. 10,
    • Standard Test Method for Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tension Loading (Metal-to-Metal). Am. Soc. Testing and Mater. Oct. 10, 2001, ASTM D1002.
    • (2001) Am. Soc. Testing and Mater.
  • 440
    • 84882179238 scopus 로고    scopus 로고
    • Die Shear Strength, MIL-STD-883F, Method 2019.7 (Mar. 2003)
    • Die Shear Strength, MIL-STD-883F, Method 2019.7 (Mar. 2003).
  • 441
    • 84882213773 scopus 로고    scopus 로고
    • Substrate Attach Strength, MIL-STD-883F, Method 2027 (Mar. 1989)
    • Substrate Attach Strength, MIL-STD-883F, Method 2027 (Mar. 1989).
  • 442
    • 84882174999 scopus 로고    scopus 로고
    • Constant Acceleration, MIL-STD-883F, Method 2001 (Aug. 1977)
    • Constant Acceleration, MIL-STD-883F, Method 2001 (Aug. 1977).
  • 443
    • 84882158264 scopus 로고    scopus 로고
    • Performance Specification, Hybrid Microcircuits
    • MIL-PRF-38534E, Jan.
    • Performance Specification, Hybrid Microcircuits. General Specification Jan. 2003, MIL-PRF-38534E.
    • (2003) General Specification
  • 444
    • 84882130819 scopus 로고    scopus 로고
    • Mechanical Shock, MIL-STD-883F, Method 2002.4 (Aug. 1998)
    • Mechanical Shock, MIL-STD-883F, Method 2002.4 (Aug. 1998).
  • 445
    • 84882159803 scopus 로고    scopus 로고
    • Ultrasonic Inspection of Die Attach, MIL-STD-883F, Method 2030, (May 1987)
    • Ultrasonic Inspection of Die Attach, MIL-STD-883F, Method 2030, (May 1987).
  • 447
    • 84882165034 scopus 로고
    • Radius of Curvature
    • Ablestik Laboratories, a National Starch and Chemical Company, Nov.
    • Radius of Curvature. Test Method TM-MT-15 Nov. 1994, Ablestik Laboratories, a National Starch and Chemical Company.
    • (1994) Test Method TM-MT-15
  • 448
    • 84882194411 scopus 로고    scopus 로고
    • Weight Loss During Cure
    • Ablestik Laboratories, a National Starch and Chemical Company, May 31,
    • Weight Loss During Cure. Test Method PT-80 May 31, 1996, Ablestik Laboratories, a National Starch and Chemical Company.
    • (1996) Test Method PT-80
  • 450
    • 84882204250 scopus 로고    scopus 로고
    • Standard Practice for General Techniques for Obtaining Infrared Spectra for Qualitative Analysis
    • ASTM E1252, Oct. 3,
    • Standard Practice for General Techniques for Obtaining Infrared Spectra for Qualitative Analysis. Am. Soc. Testing and Mater. Oct. 3, 1998, ASTM E1252.
    • (1998) Am. Soc. Testing and Mater.
  • 451
    • 0003464216 scopus 로고    scopus 로고
    • NIST Standard Reference Database, No. 69
    • Jul.
    • NIST Standard Reference Database, No. 69. NIST Chemistry WebBook Jul. 2001, http://www.webbook.nist.gov.
    • (2001) NIST Chemistry WebBook
  • 452
    • 84882208765 scopus 로고    scopus 로고
    • Internal Water-Vapor Content, MIL-STD-883F, Method 1018.4 (Jun. 2004)
    • Internal Water-Vapor Content, MIL-STD-883F, Method 1018.4 (Jun. 2004).
  • 453
    • 33748944758 scopus 로고    scopus 로고
    • Standard Test Method for Total Mass Loss and Collected Volatile Condensible Materials from Outgassing in a Vacuum Environment
    • ASTM E595
    • Standard Test Method for Total Mass Loss and Collected Volatile Condensible Materials from Outgassing in a Vacuum Environment. Am. Soc. Testing and Mater. 1999, ASTM E595.
    • (1999) Am. Soc. Testing and Mater.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.