Properties of conductive adhesives based on anhydride-cured epoxy systems

Journal of Electronics Manufacturing

Volumn 9, Issue 3, 1999, Pages 223-232

  Lu, Daoqiang ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; AGING OF MATERIALS; BOND STRENGTH (MATERIALS); ELECTRONICS PACKAGING; EPOXY RESINS; HIGH TEMPERATURE EFFECTS; METALS; MOISTURE; PLASTICS FILLERS; RELIABILITY; SURFACE MOUNT TECHNOLOGY; SURFACES;

ANHYDRIDE; ANHYDRIDE CURED EPOXY SYSTEMS; CONTACT RESISTANCE; ISOTROPIC CONDUCTIVE ADHESIVES; NON NOBLE METALS;

SOLDERING;

EID: 0033295041     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313199000143     Document Type: Article

References (15)

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