CSP and flip chip underfill

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Volumn 10, Issue 6, 2001, Pages 37-44

  Adamson, S J ^a  

^a Asymtek Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 8344234221     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (1)

1. Martin Bartholomew, "An Engineer's Handbook of Encapsulation and Underfill Technology," 1999, p. 2., Electrochemical Publications, Ltd., Port Erin, Isle of Man, British Isles