Engineering surfaces in ceramic pin grid array packaging to inhibit epoxy bleeding

Hewlett-Packard Journal

Volumn 49, Issue 3, 1998, Pages 81-89

  Tan, Ningxia ^a   Lim, Kenneth H H ^a   Chin, Berhard ^a   Bourdillon, Anthony J ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY RESINS; INTERFACES (MATERIALS); INTERFACIAL ENERGY; SUBSTRATES;

CERAMIC PIN GRID ARRAY PACKAGING; EPOXY BLEEDING;

ELECTRONICS PACKAGING;

EID: 0032141318     PISSN: 00181153     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

1. J.E. Ireland, "Epoxy Bleedout in Ceramic Chip Carriers," International Journal for Hybrid Microelectronics, Vol. 5, no. 1, 1982.
2. N.X. Tan, A.J.Y. Lee, A.J. Bourdillon, and C.Y.S. Tan, "Orientation Anomalies in Plating Thickness Measurements from Advanced Packaging Substrates," Semiconductor Science and Technology, Vol. 17, 1996, p. 437.
3. C.A. Miller and P. Neogi, Interfacial Phenomena: Equilibrium and Dynamic Effects, Marcel Dekker, New York, 1980, pp. 54-83.
4. S. Wu and K.J. Brzozowski, "Surface Free Energy and Polarity of Organic Pigments," Journal of Colloid and Interface Science, Vol. 37, 1971, p. 686.
5. V.A. Parsegian, G.H. Weiss, and M.E. Schrader, "Macroscopic Continuum Model in Influence of Hydrocarbon Contaminants on Forces Causing Wetting of Gold by Water," Journal of Colloid and Interface Science, Vol. 61, 1977, p. 356.
6. W.R. Tyson and W.A. Miller, "Surface Free Energies of Solid Metals: Estimation from Liquid Surface Tension Measurements," Surface Science, Vol. 62, 1977, p. 267.
7. A.W. Adamson, Physical Chemistry of Surfaces, second edition, Wiley Interscience, 1967.
8. J.J. Bikerman, Physical Surfaces, Academic Press, 1970.
9. N.X. Tan, K.H.H. Lim, and A.J. Bourdillon,"Analysis of Coatings Which Inhibit Epoxy Bleeding in Electronic Packaging," Journal of Material Science: Materials in Electronics, Vol. 8, 1997, p. 173.
10. Test Methods and Procedures for Microelectronics, Mil-Std-883D, Method 2019.5, 1993.