SMA Dispensing Trends

SMT Surface Mount Technology Magazine

Volumn 15, Issue 1, 2001, Pages 86-92

  Piracci, Anthony F ^a  

^a A Nordson Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT LAYOUT; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; PRODUCTIVITY; SOLDERING; SUBSTRATES;

NEEDLE BASED SELECTIVE DISPENSING; NONCONTACT JET DISPENSING; PIN TRANSFER METHOD; SURFACE MOUNT ADHESIVES;

SURFACE MOUNT TECHNOLOGY;

EID: 17744417051     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. Van Den Bosch, A. and DeBarros, T., Step-ByStep SMT, Adhesives/Epoxies fit Dispensing, SMr, May 1997, pp. 102-107.
2. Reighard, M., Non-Contact SMA Jetting: Reliability and Performance Enter the Manufacturing Environment, NEPCON West 1999 Proceedings.