Fundamental study on adhesion improvement for underfill using adhesion promoter

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1502-1506

  Welsh, D J ^a   Pearson, R A ^a   Luo, S ^a   Wong, C P ^a  

^a LEHIGH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; AGING OF MATERIALS; ATMOSPHERIC HUMIDITY; HIGH TEMPERATURE EFFECTS; MOLECULES; SILANES; TITANIUM COMPOUNDS; ZIRCONIUM COMPOUNDS;

ADHESION PROMOTER; DIE SHEAR TESTS; FLOW MICROCALORIMETRY; TITANATE; ZIRCONATE;

ADHESION;

EID: 0034822518     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.928035     Document Type: Article

References (9)

1. Flip the chip
2. Effects of adhesion and delamination on stress singularities in plastic-packaged intergrated circuits
3. Acid-based properties of glass surfaces
4. A four-parameter equation for predicting enthalpies of adduct formation
5. Controlling factors in chemical coupling of polymers to metals
6. Enhancement on underfill adhesion to die and substrate by use of silane additives
7. Segmental adsorption energies for polymers on silica and alumina