Rheological analysis of an underfill material

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 354-358

  Rasiah, Ignatius J ^a   Ho, P S ^a   Manoharan, M ^a   Ng, C L ^a   Chau, Michael ^a  

^a Johnson Matthey (S) Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; FLIP CHIP DEVICES; MICROELECTRONICS; PERMITTIVITY;

UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0032230854     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)