Developing an underfill process for dense flip chip applications

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1996, Pages 10-17

  Leong, William H ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FILLERS; SOLDERED JOINTS; SUBSTRATES;

UNDERFILL PROCESS;

FLIP CHIP DEVICES;

EID: 0030398250     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)