Recent advancements in olefin thermoset adhesive

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 878-881

  Nguyen, My N ^a   Chien, Irving Y ^a   Knoll, Paula M ^a  

^a HONEYWELL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ADHESIVES; HYDROPHOBICITY; MOISTURE; MOLECULAR STRUCTURE; MOLECULAR WEIGHT; NEURAL NETWORKS; OLEFINS; THERMOSETS;

BALL GRID ARRAY PACKAGES; HYDROPHOBIC MOLECULAR STRUCTURE; MODIFIED CYCLIC OLEFIN THERMOSET; MOISTURE ABSORPTION; NEURAL NETWORK ANALYZER MODEL;

ELECTRONICS PACKAGING;

EID: 0034478823     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)