Stress effects of epoxy adhesives on ceramic substrates and magnetics

Microelectronics Reliability

Volumn 41, Issue 4, 2001, Pages 499-510

  Swanson, Dale W ^a   Enlow, Leonard R ^b  

^a BOEING COMPANY   (United States)

^b Electronic Packaging Associates   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CERAMIC MATERIALS; CORRELATION METHODS; CRACK PROPAGATION; ELECTRONICS PACKAGING; EPOXY RESINS; MAGNETIC MATERIALS; MATHEMATICAL MODELS; STRESS ANALYSIS; SUBSTRATES; THERMAL CYCLING; THERMAL STRESS;

ENVIRONMENTAL STRESS SCREENING; EPOXY ADHESIVES;

MICROELECTRONICS;

EID: 0035310644     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00263-8     Document Type: Article

References (3)