Thermal ratcheting of solder-bonded elastic and elastoplastic layers

International Journal of Plasticity

Volumn 24, Issue 10, 2008, Pages 1819-1836

  Nakane, Kazuhiko ^a   Ohno, Nobutada ^a   Tsuda, Masatoshi ^a   Yagi, Yuji ^b   Nakagawa, Ikuo ^c   Atsumi, Takashi ^c  

^a NAGOYA UNIVERSITY   (Japan)

^b Rd Management Section   (Japan)

^c TOYOTA MOTOR CORPORATION   (Japan)

Author keywords

Constitutive behavior; Cyclic thermal loading; Finite elements; Layered structures; Ratcheting

Indexed keywords

BRAZING; DEFLECTION (STRUCTURES); ELASTOPLASTICITY; FINITE ELEMENT METHOD; HARDENING; LEAD; LEAD ALLOYS; PLASTICITY; TIN ALLOYS; VISCOPLASTICITY; VISCOSITY; WELDING;

CONTROLLING FACTORS; CYCLIC GROWTH; CYCLIC HARDENING; CYCLIC PLASTICITY; CYCLIC THERMAL LOADING; DEFLECTION (OVALIZATION); ELASTIC STRESSES; ELASTO PLASTIC; ELSEVIER (CO); FINITE ELEMENT ANALYSIS (FEA); ISOTROPIC HARDENINGS; LAYERED STRUCTURED; POWER LAWS; SI LAYER; TEMPERATURE CYCLING; TEMPERATURE DEPENDENT; VISCO-PLASTIC;

COPPER ALLOYS;

EID: 47049112230     PISSN: 07496419     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijplas.2007.12.008     Document Type: Article

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