High-temperature creep behavior of low-temperature-sintered nano-silver paste films

Journal of Electronic Materials

Volumn 41, Issue 4, 2012, Pages 782-790

  Chen, Gang ^a   Sun, Xiu Hu ^a   Nie, Peng ^a   Mei, Yun Hui ^a   Lu, Guo Quan ^a   Chen, Xu ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

creep; damage evolution; life prediction; low temperature sintering; Nano silver paste

Indexed keywords

ACCURATE MEASUREMENT; CREEP BEHAVIORS; CREEP LIFE; CREEP RUPTURE LIFE; CREEP STRAIN RATE; CREEP TESTS; DAMAGE EVOLUTION; HIGH TEMPERATURE CREEP; LIFE PREDICTIONS; LOW-TEMPERATURE SINTERING; MONKMAN-GRANT RELATIONSHIP; NANO SILVER; POWER LAW CREEP; STEADY STATE CREEP RATE; TEMPERATURE RANGE; TEST CONDITION; TESTING SYSTEMS; UNIAXIAL FATIGUE;

CREEP; FATIGUE TESTING; SINTERING; TEMPERATURE; TENSILE STRESS;

SILVER;

EID: 84862782471     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-012-1903-2     Document Type: Article

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