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Materials Chemistry and Physics

Volumn 136, Issue 2-3, 2012, Pages 325-333

Interfacial reactions of high-temperature Zn-Sn solders with Ni substrate

(3) Wang, Chao Hong a Chen, Hsien Hsin a Li, Po Yi a

a NATIONAL CHUNG CHENG UNIVERSITY (Taiwan)

Author keywords

Diffusion; Interfaces; Intermetallic compounds; Microstructure

Indexed keywords

GROWTH MECHANISMS; HIGH TEMPERATURE; INTERFACIAL PRODUCTS; LINEAR GROWTH; MICROSTRUCTURAL OBSERVATIONS; MICROSTRUCTURAL VARIATION; NI SUBSTRATES; POROUS STRUCTURES;

DIFFUSION; INTERFACES (MATERIALS); INTERMETALLICS; KINETICS; MICROSTRUCTURE; REACTION KINETICS; SOLDERING ALLOYS; TIN;

ZINC;

EID: 84867396516 PISSN: 02540584 EISSN: None Source Type: Journal
DOI: 10.1016/j.matchemphys.2012.03.057 Document Type: Article

Times cited : (13)

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