Cellular to dendritic transition during transient solidification of a eutectic Sn-0.7 wt%Cu solder alloy

Materials Chemistry and Physics

Volumn 132, Issue 1, 2012, Pages 203-209

  Moura, Itamazeo T L ^a   Silva, Celina L M ^a   Cheung, Noé ^b   Goulart, Pedro R ^b   Garcia, Amauri ^c   Spinelli, José E ^d  

^a Centro Federal de Educacao Tecnologica do Rio Grande do Norte   (Brazil)

^b INSTITUTO FEDERAL DE EDUCAÇÃO   (Brazil)

^c UNIVERSITY OF CAMPINAS   (Brazil)

^d FEDERAL UNIVERSITY OF SÃO CARLOS   (Brazil)

Author keywords

Alloys; Microstructure; Optical metallography; Solidification

Indexed keywords

COOLING RATES; CU ALLOY; ELECTRONIC DEVICE; EUTECTIC COLONIES; GROWTH LAWS; INTER-METALLIC PARTICLE; METALLIC SURFACE; MICROSTRUCTURAL MORPHOLOGY; OPTICAL METALLOGRAPHY; SN-PB ALLOYS; SOLDER ALLOYS; SOLDERING PROCESS; THERMAL PARAMETERS;

ALLOYS; CERIUM ALLOYS; COOLING; COPPER ALLOYS; EUTECTICS; INTERMETALLICS; LEAD; MECHANICAL PROPERTIES; METALLIC COMPOUNDS; MICROSTRUCTURE; MORPHOLOGY; SOLDERING; SOLIDIFICATION; TIN ALLOYS;

TIN;

EID: 84355165234     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2011.11.033     Document Type: Article

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