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Journal of Electronic Materials

Volumn 38, Issue 11, 2009, Pages 2222-2227

Interfacial reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) solders with ni substrates

(3) Liou, Wei Kai a Yen, Yee Wen a Jao, Chien Chung a,b

a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

b TA HWA INSTITUTE OF TECHNOLOGY (Taiwan)

Author keywords

Cu content; Interfacial reaction; Reaction time; Sn 9Zn xCu Ni couple; Ternary isothermal section

Indexed keywords

CU CONTENT; INTERFACIAL REACTION; REACTION TIME; SN-9ZN-XCU/NI COUPLE; TERNARY ISOTHERMAL SECTION;

COPPER ALLOYS; COPPER COMPOUNDS; FACE RECOGNITION; HUMAN REACTION TIME; ISOTHERMS; NICKEL; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TERNARY SYSTEMS; TIN ALLOYS; ZINC;

TIN;

EID: 70349869174 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0880-6 Document Type: Article

Times cited : (27)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.