-
1
-
-
51649139688
-
Lead-free solders for electronic packaging
-
S. Kung, A. K. Sarkhel, Lead-free solders for electronic packaging, Journal of Electronic Materials 23 (8) (1994) 701-707.
-
(1994)
Journal of Electronic Materials
, vol.23
, Issue.8
, pp. 701-707
-
-
Kung, S.1
Sarkhel, A.K.2
-
2
-
-
33845684212
-
Phase diagrams of Pb-free solders and their related materials systems
-
DOI 10.1007/s10854-006-9010-x
-
S.-W. Chen, C.-H. Wang, S.-K. Lin, C.-N. Chiu, Phase diagrams of Pb-free solders and their related materials systems, Journal of Materials Science: Materials in Electronics 18 (2007) 19-37. (Pubitemid 44963675)
-
(2007)
Journal of Materials Science: Materials in Electronics
, vol.18
, Issue.1-3
, pp. 19-37
-
-
Chen, S.-W.1
Wang, C.-H.2
Lin, S.-K.3
Chiu, C.-N.4
-
3
-
-
1842831443
-
Reliability issues for flip-chip packages
-
P. S. Ho, G. Wang, M. Ding, J.-H. Zhao, X. Dai, Reliability issues for flip-chip packages, Microelectronics Reliability 44 (2004) 719-737.
-
(2004)
Microelectronics Reliability
, vol.44
, pp. 719-737
-
-
Ho, P.S.1
Wang, G.2
Ding, M.3
Zhao, J.-H.4
Dai, X.5
-
5
-
-
61649128557
-
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
-
K. Sakuma, K. P. S. Andry, C. K. Tsang, S. L. Wright, B. Dang, C. S. Patel, B. C. Webb, J. Maria, E. J. Sprogis, S. K. Kang, R. J. Polastre, R. R. Horton, J. U. Knickerbocker, 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections, IBM Journal of Research and Development 52 (6) (2008) 611-622.
-
(2008)
IBM Journal of Research and Development
, vol.52
, Issue.6
, pp. 611-622
-
-
Sakuma, K.1
Andry, K.P.S.2
Tsang, C.K.3
Wright, S.L.4
Dang, B.5
Patel, C.S.6
Webb, B.C.7
Maria, J.8
Sprogis, E.J.9
Kang, S.K.10
Polastre, R.J.11
Horton, R.R.12
Knickerbocker, J.U.13
-
6
-
-
0021565116
-
-
Electrochemical Publications, British Isled, England
-
R. J. Klein Wassink, Soldering in Electronics, 2nd ed., Electrochemical Publications, British Isled, England, 1989.
-
(1989)
Soldering in Electronics, 2nd Ed
-
-
Klein Wassink, R.J.1
-
7
-
-
0002021038
-
Physical metallurgy ofsolder-substrate reactions
-
D. R. Frear, W. B. Jones, K. R. Kinsman (Eds.) Warrendale, PA
-
A. D. Romig Jr., Y. A. Chang, J. J. Stephens, D. R. Frear, V. Marcotte, C. Lea, Physical metallurgy ofsolder-substrate reactions, in: D. R. Frear, W. B. Jones, K. R. Kinsman (Eds.), Solder Mechanics: A State of the Art Assessment, TMS, Warrendale, PA, 1991, pp. 19-104.
-
(1991)
Solder Mechanics: A State of the Art Assessment, TMS
, pp. 19-104
-
-
Romig Jr., A.D.1
Chang, Y.A.2
Stephens, J.J.3
Frear, D.R.4
Marcotte, V.5
Lea, C.6
-
8
-
-
20344388336
-
Interfacial reactions between lead-free solders and common base materials
-
DOI 10.1016/j.mser.2005.03.001, PII S0927796X05000513
-
T. Laurila, V. Vuorinen, J. K. Kivilahti, Interfacial reactions between lead-free solders and common base materials, Materials Science and Engineering Reports 49 (2005) 1-60. (Pubitemid 40788671)
-
(2005)
Materials Science and Engineering R: Reports
, vol.49
, Issue.1-2
, pp. 1-60
-
-
Laurila, T.1
Vuorinen, V.2
Kivilahti, J.K.3
-
9
-
-
33846482155
-
Phase transformation and microstructural evolution in the solderjoints
-
S.-W. Chen, C.-H. Wang, S.-K. Lin, C.-N. Chiu, C.-C. Chen, Phase transformation and microstructural evolution in the solderjoints, JOM 59 (1) (2007) 41-45.
-
(2007)
JOM
, vol.59
, Issue.1
, pp. 41-45
-
-
Chen, S.-W.1
Wang, C.-H.2
Lin, S.-K.3
Chiu, C.-N.4
Chen, C.-C.5
-
10
-
-
0141703084
-
Evaluation of corrosion behaviour of a new class of Pb-free solder materials (Sn-In-Zn)
-
A. Sabbar, S. El Hajjaji, A. Ben Bachir, M. Alaoui-El Belghiti, A. Zrineh, Evaluation of corrosion behaviour of a new class of Pb-free solder materials (Sn-In-Zn), Materials and corrosion-werkstoffe und corrosion 52 (4) (2001) 298-301. (Pubitemid 33770940)
-
(2001)
Werkstoffe und Korrosion
, vol.52
, Issue.4
, pp. 298-301
-
-
Sabbar, A.1
El Hajjaji, S.2
Ben Bachir, A.3
Alaoui-El Belghiti, M.4
Zrineh, A.5
-
11
-
-
0034320035
-
Interfacial reactions between In10Ag solders and Ag substrates
-
Y. M. Liu, T. H. Chuang, Interfacial reactions between In10Ag solders and Ag substrates, Journal of Electronic Materials 29 (11) (2000) 1328-1332. (Pubitemid 32020389)
-
(2000)
Journal of Electronic Materials
, vol.29
, Issue.11
, pp. 1328-1332
-
-
Liu, Y.M.1
Chuang, T.H.2
-
12
-
-
0036503099
-
Soldering reactions between In49Sn and Ag thick films
-
M. D. Cheng, S. S. Wang, T. H. Chuang, Soldering reactions between In49Sn and Ag thick films, Journal of Electronic Materials 31 (3) (2002) 171-177. (Pubitemid 34306424)
-
(2002)
Journal of Electronic Materials
, vol.31
, Issue.3
, pp. 171-177
-
-
Cheng, M.D.1
Wang, S.S.2
Chuang, T.H.3
-
13
-
-
39649124693
-
Phase equilibria of the Sn-Zn-Ag system and interfacial reactions inthe Sn-Zn/Ag couples
-
C.-C. Jao, Y.-W. Yen, C.-Y. Lin, C. Lee, Phase equilibria of the Sn-Zn-Ag system and interfacial reactions inthe Sn-Zn/Ag couples, Intermetallics 16 (2008) 463-469.
-
(2008)
Intermetallics
, vol.16
, pp. 463-469
-
-
Jao, C.-C.1
Yen, Y.-W.2
Lin, C.-Y.3
Lee, C.4
-
14
-
-
25444439340
-
Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering
-
J.-M. Song, P.-C. Liu, C.-L. Shih, K.-L. Lin, Role of Agin the formation of interfacial intermetallic phases in Sn-Zn soldering, Journal of Electronic Materials 34 (9) (2005) 1249-1254. (Pubitemid 41374792)
-
(2005)
Journal of Electronic Materials
, vol.34
, Issue.9
, pp. 1249-1254
-
-
Song, J.-M.1
Liu, P.-C.2
Shih, C.-L.3
Lin, K.-L.4
-
15
-
-
0036944619
-
Interfacial reaction between liquid Sn-20In-2. 8Ag solder and Ag substrate
-
M. J. Chiang, T. H. Chuang, Interfacial reaction between liquid Sn-20In-2. 8Ag solder and Ag substrate, Zeitschrift fur MetaI lkunde 93 (12) (2002) 1194-1198.
-
(2002)
Zeitschrift fur MetaI Lkunde
, vol.93
, Issue.12
, pp. 1194-1198
-
-
Chiang, M.J.1
Chuang, T.H.2
-
16
-
-
79957886961
-
Sn-In-Ag phase equilibria and Sn-In-(Ag)/Ag interfacial reactions
-
S.-W. Chen, W.-Y. Lee, CM. Hsu, C.-F. Yang, H.-Y. Hsu, H.-J. Wu, Sn-In-Ag phase equilibria and Sn-In-(Ag)/Ag interfacial reactions, Materials Chemistry and Physics 128 (3) (2011) 357-364.
-
(2011)
Materials Chemistry and Physics
, vol.128
, Issue.3
, pp. 357-364
-
-
Chen, S.-W.1
Lee, W.-Y.2
Hsu, C.M.3
Yang, C.-F.4
Hsu, H.-Y.5
Wu, H.-J.6
-
17
-
-
0036476322
-
Interfacial reactions in In-Sn/Ni couples and phase equilibria of the In-Sn-Ni system
-
C.-Y. Huang, S.-W. Chen, Interfacial reactions in In-Sn/Ni and phase equilibria of the In-Sn-Ni system, Journal of Electronic Materials 31 (2) (2002) 152-160. (Pubitemid 34306418)
-
(2002)
Journal of Electronic Materials
, vol.31
, Issue.2
, pp. 152-160
-
-
Huang, C.-Y.1
Chen, S.-W.2
-
18
-
-
0026880633
-
Microstructure and creep of eutectic Indium/Tin on copper and nickel substrates
-
J. L. Freer, J. W. Morris Jr., Microstructure and creep of eutectic Indium/Tin on copper and nickel substrates, Journal of Electronic Materials 21 (6) (1992) 647-652.
-
(1992)
Journal of Electronic Materials
, vol.21
, Issue.6
, pp. 647-652
-
-
Freer, J.L.1
Morris Jr., J.W.2
-
19
-
-
77951256304
-
Interfacial reactions between Sn-Zn alloys and Ni substrates
-
W. Zhu, H. Liu, J. Wang, G. Ma, Z. Jin, Interfacial reactions between Sn-Zn alloys and Ni substrates, Journal of Electronic Materials 39 (2) (2010) 209-214.
-
(2010)
Journal of Electronic Materials
, vol.39
, Issue.2
, pp. 209-214
-
-
Zhu, W.1
Liu, H.2
Wang, J.3
Ma, G.4
Jin, Z.5
-
20
-
-
78149285664
-
Study ofthe effects of Zn content on the interfacial reactions between Sn-Zn solders and Ni substrates at 250°C
-
C-H. Wang, H.-H. Chen, Study ofthe effects of Zn content on the interfacial reactions between Sn-Zn solders and Ni substrates at 250°C, Journal of Electronic Materials 39 (11) (2010) 2375-2381.
-
(2010)
Journal of Electronic Materials
, vol.39
, Issue.11
, pp. 2375-2381
-
-
Wang, C.-H.1
Chen, H.-H.2
-
21
-
-
67650786977
-
Study on the solidus line in Sn-rich region of Sn-In phase diagram
-
C.-H. Yeh, L.-S. Chang, B. Straumal, Study on the solidus line in Sn-rich region of Sn-In phase diagram, Journal of Phase Equilibria and Diffusion30 (3) (2009) 254-257.
-
(2009)
Journal of Phase Equilibria and Diffusion
, vol.30
, Issue.3
, pp. 254-257
-
-
Yeh, C.-H.1
Chang, L.-S.2
Straumal, B.3
-
22
-
-
0030146520
-
A thermodynamic study on the Ag-Sb-Sn system
-
C. S. Oh, J. H. Shim, B. J. Lee, D. N. Lee, A thermodynamic study on the Ag-Sb-Sn system, Journal of Alloys and Compounds 238 (1996) 155-166. (Pubitemid 126374003)
-
(1996)
Journal of Alloys and Compounds
, vol.238
, Issue.1-2
, pp. 155-166
-
-
Oh, C.-S.1
Shim, J.-H.2
Lee, B.-J.3
Lee, D.N.4
-
23
-
-
0035455377
-
Studies of the Ag-In phase diagram and surface tension measurements
-
Lead-Free Solder Materials and Soldering Technologies
-
Z. Moser, W. Gasior, J. Pstrus, W. Zakulski, I. Ohnuma, X. J. Liu, Y. Inohana, K. Ishida, Study ofthe Ag-In phase diagrams and surface tension measurements, Journal of Electronic Materials 30 (9) (2001) 1120-1128. (Pubitemid 33090675)
-
(2001)
Journal of Electronic Materials
, vol.30
, Issue.9
, pp. 1120-1128
-
-
Moser, Z.1
Gasior, W.2
Pstrus, J.3
Zakulski, W.4
Ohnuma, I.5
Liu, X.J.6
Inohana, Y.7
Ishida, K.8
-
24
-
-
0032021456
-
Thermodynamics of the Sn-In-Ag solder system
-
T.-M. Korhonen, J. K. Kivilahti, Thermodynamics ofthe Sn-In-Ag Solder System, Journal of Electronic Materials 27 (3) (1998) 149-158. (Pubitemid 128571401)
-
(1998)
Journal of Electronic Materials
, vol.27
, Issue.3
, pp. 149-158
-
-
Korhonen, T.-M.1
Kivilahti, J.K.2
-
25
-
-
0036867860
-
Experimental determination and thermodynamic calculation ofthe phase equilibria and surface tension inthe Sn-Ag-In system
-
X. J. Liu, Y. Inohana, Y. Takaku, I. Ohnuma, R. Kainuma, K. Ishisa, Z. Moser, W. Gasior, J. Pstrus, Experimental determination and thermodynamic calculation ofthe phase equilibria and surface tension inthe Sn-Ag-In system, Journal of Electronic Materials 31 (11) (2002) 1139-1151.
-
(2002)
Journal of Electronic Materials
, vol.31
, Issue.11
, pp. 1139-1151
-
-
Liu, X.J.1
Inohana, Y.2
Takaku, Y.3
Ohnuma, I.4
Kainuma, R.5
Ishisa, K.6
Moser, Z.7
Gasior, W.8
Pstrus, J.9
-
26
-
-
55349132696
-
Thermodynamic properties and phase equilibria of Sn-Bi-Zn ternary alloys
-
C.-F. Yang, F.-L. Chen, W. Gierlotka, S.-W. Chen, K.-C. Hsieh, L.-L. Huang, Thermodynamic properties and phase equilibria of Sn-Bi-Zn ternary alloys, Materials Chemistry and Physics 112 (2008) 94-103.
-
(2008)
Materials Chemistry and Physics
, vol.112
, pp. 94-103
-
-
Yang, C.-F.1
Chen, F.-L.2
Gierlotka, W.3
Chen, S.-W.4
Hsieh, K.-C.5
Huang, L.-L.6
-
27
-
-
0035942803
-
Thermodynamic calculation of the In-Sn-Zn ternary system
-
DOI 10.1016/S0925-8388(00)01484-5, PII S0925838800014845
-
Y. Cui, X. J. Liu, I. Ohnuma, R. kainuma, H. Ohtani, K. Ishida, Thermodynamic calculation ofthe In-Sn-Zn ternary system, Journal of Alloys and Compounds 320 (2001) 234-241. (Pubitemid 32405097)
-
(2001)
Journal of Alloys and Compounds
, vol.320
, Issue.2
, pp. 234-241
-
-
Cui, Y.1
Liu, X.J.2
Ohnuma, I.3
Kainuma, R.4
Ohtani, H.5
Ishida, K.6
-
28
-
-
0035975172
-
Studies of the phase equilibria in the Ag-Sn-Zn system
-
DOI 10.1016/S0925-8388(01)01562-6, PII S0925838801015626
-
G. P. Vassilev, E. S. Dobrev, S. K. Evimova, J.-C. Tedenac, Studies ofthe phase equilibria in the Ag-Sn-Zn system, Journal of Alloys and Compounds 327 (2001) 285-291. (Pubitemid 32771029)
-
(2001)
Journal of Alloys and Compounds
, vol.327
, Issue.1-2
, pp. 285-291
-
-
Vassilev, G.P.1
Dobrev, E.S.2
Evtimova, S.K.3
Tedenac, J.-C.4
-
31
-
-
0020154612
-
Multiphase diffusion inthe systems Fe-Sn and Ni-Sn
-
J. A. van Beek, S. A. Stolk, F. J. J. van Loo, Multiphase diffusion inthe systems Fe-Sn and Ni-Sn, Zeitschrift fur MetaIlkunde 73 (7) (1982) 439-444.
-
(1982)
Zeitschrift fur MetaIlkunde
, vol.73
, Issue.7
, pp. 439-444
-
-
Van Beek, J.A.1
Stolk, S.A.2
Van Loo, F.J.J.3
-
32
-
-
17044377137
-
Thermodynamic optimization of the Ni-Sn binary system
-
DOI 10.1016/j.calphad.2004.12.002, PII S0364591605000039
-
H. S. Liu, J. Wang, Z. P. Jin, Thermodynamic optimization ofthe Ni-Sn binary system, Computer Coupling of Phase Diagrams and Thermochemistry 28 (2004) 363-370. (Pubitemid 40497340)
-
(2004)
Calphad: Computer Coupling of Phase Diagrams and Thermochemistry
, vol.28
, Issue.4
, pp. 363-370
-
-
Liu, H.S.1
Wang, J.2
Jin, Z.P.3
-
33
-
-
0003990901
-
-
C. E. T. White, H. Okamoto (Eds.) Materials Park, OH
-
M. F. Singleton, P. Nash, in: C. E. T. White, H. Okamoto (Eds.), Phase Diagrams of Indium Alloys and Their Engineering Applications, ASM International, Materials Park, OH, 1992, pp. 186-190.
-
(1992)
Phase Diagrams of Indium Alloys and Their Engineering Applications, ASM International
, pp. 186-190
-
-
Singleton, M.F.1
Nash, P.2
-
35
-
-
84856601974
-
-
Ph. D. Thesis, National Tsing Hua University, Hsin-chu, Taiwan
-
C.-Y. Chou, Ph. D. Thesis, National Tsing Hua University, Hsin-chu, Taiwan, 2006.
-
(2006)
-
-
Chou, C.-Y.1
-
36
-
-
78049516788
-
Phase equilibria in the Sn-Ni-Zn ternary system: Isothermal sections at 200 °c, 500 °c and 800 °c
-
J. Chang, S.-K. Seo, H. M. Lee, Phase equilibria in the Sn-Ni-Zn ternary system: isothermal sections at 200 °C, 500 °C and 800 °C, Journal of Electronic Materials 39 (12) (2010) 2643-2652.
-
(2010)
Journal of Electronic Materials
, vol.39
, Issue.12
, pp. 2643-2652
-
-
Chang, J.1
Seo, S.-K.2
Lee, H.M.3
-
37
-
-
33747458084
-
Interfacial reactions in the Sn-9Zn-(xCu)/Cu and Sn-9Zn-(xCu)/Ni couples
-
DOI 10.1557/jmr.2006.0229
-
C.-Y. Chou, S.-W. Chen, Y.-S. Chang, Interfacial reactions intheSn-9Zn-(xCu)/Cu and Sn-9Zn-(xCu)/Ni couples, Journal of Materials Research 21 (7) (2006) 1849-1856. (Pubitemid 44256207)
-
(2006)
Journal of Materials Research
, vol.21
, Issue.7
, pp. 1849-1856
-
-
Chou, C.-Y.1
Chen, S.-W.2
Chang, Y.-S.3
-
38
-
-
0036471978
-
Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates
-
Y. C. Chan, M. Y. Chou, T. H. Chuang, Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates, Zeitschrift fur MetaIlkunde 93 (2002) 95-98. (Pubitemid 34181352)
-
(2002)
Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques
, vol.93
, Issue.2
, pp. 95-98
-
-
Chan, Y.C.1
Chiu, M.Y.2
Chuang, T.H.3
-
39
-
-
3142756580
-
-
M. Date, T. Shoji, M. Fujiyoshi, K. Sato, K. N. Tu, Scripta Materialia 51 (2004) 641-645.
-
(2004)
Scripta Materialia
, vol.51
, pp. 641-645
-
-
Date, M.1
Shoji, T.2
Fujiyoshi, M.3
Sato, K.4
Tu, K.N.5
-
40
-
-
84856602496
-
-
Massalski FT.B (Ed.) ASM International, Materials Park, OH
-
P. Nash, Y. Y. Nash, in: Massalski FT.B (Ed.), Alloy Phase Diagrams, 2nd ed., ASM International, Materials Park, OH, 1990, pp. 2887-2889.
-
(1990)
Alloy Phase Diagrams, 2nd Ed
, pp. 2887-2889
-
-
Nash, P.1
Nash, Y.Y.2
-
41
-
-
27744561345
-
Sn-0.7wt%Cu/Ni interfacial reactions at 250°C
-
C.-H. Wang, S.-W. Chen, Sn-0. 7wt%Cu/Ni interfacial reactions at 250°C, Acta Materialia 54 (1) (2006) 247-253.
-
(2006)
Acta Materialia
, vol.54
, Issue.1
, pp. 247-253
-
-
Wang, C.-H.1
Chen, S.-W.2
|