Growth kinetics of the solid-state interfacial reactions in the Sn-Cu/Co and Sn/Co-Cu couples

Materials Chemistry and Physics

Volumn 130, Issue 1-2, 2011, Pages 651-656

  Wang, Chao Hong ^a   Kuo, Chun Yi ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Interfaces, Intermetallic compounds, Annealing, Diffusion

Indexed keywords

ALLOYING EFFECT; CO-CU ALLOYS; CU ADDITION; CU CONTENT; LAYER GROWTH; LINEAR GROWTH RATE; PHASE LAYERS; REACTION LAYERS; REACTION PHASIS; TEMPERATURE DEPENDENCE; TEMPERATURE-SENSITIVE;

GROWTH KINETICS; GROWTH RATE; INTERMETALLICS; PHASE INTERFACES; REACTION KINETICS; SOLDERING ALLOYS; SOLID STATE REACTIONS; TIN;

COPPER ALLOYS;

EID: 80052558196     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2011.07.042     Document Type: Article

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