Transmission electron microscopy investigation of the microstructure and chemistry of Si/Cu/In/Cu/Si interconnections

Materials Chemistry and Physics

Volumn 81, Issue 2-3, 2003, Pages 566-568

  Sommadossi, S ^a   Litynska, L ^b   Zieba, P ^b   Gust, W ^a   Mittemeijer, E J ^a  

^a UNIVERSITY OF STUTTGART   (Germany)

^b INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

Author keywords

Cu In system; Diffusion soldering; Intermetallics; Isothermal solidification

Indexed keywords

CHEMICAL BONDS; ENERGY DISPERSIVE SPECTROSCOPY; METALLIZING; SILICON COMPOUNDS; SOLDERING; TRANSMISSION ELECTRON MICROSCOPY; X RAY ANALYSIS;

ISOTHERMAL SOLIDIFICATION;

INTERMETALLICS;

EID: 0038373430     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(03)00076-2     Document Type: Conference Paper

References (13)

1. G. Humpston, D.M. Jacobson, Principles of Soldering and Brazing, ASM International, Materials Park, OH, 1993.
2. Zhou Y., Gale W.F., North T.H. Mater. Rev. 40:1995;181-196.
3. Khanna P.K., Bhatnagar S.K., Chang L.S., Gust W. Z. Metallkd. 90:1999;470-474.
4. Zieba P. Mater. Eng. XXII:2001;989-992.
5. Sommadossi S., Gust W., Mittemeijer E.J. Mater. Chem. Phys. 77:2002;924-929.
6. Sommadossi S., Gust W., Mittemeijer E.J. Z. Metallkd. 93:2002;496-501.
7. Wang S.-Q. MRS Bull. XIX:1994;30-39.
8. S. Sommadossi, P.K. Khanna, S.K. Bhatnagar, L. Lityńska, P. Zieba, W. Gust, E.J. Mittemeijer, in: Proceedings of the EUROMAT 99, vol. 4, Wiley, Weinheim, 1999, pp. 214-218.
9. S. Sommadossi, W. Gust, E.J. Mittemeijer, Mater. Sci. Technol, submitted for publication.
10. Subramanian P.R., Laughlin D.E. Bull. Alloy Phase Diagr. 10:1989;555-568.
11. Bader S., Gust W., Hieber H. Acta Metall. Mater. 43:1995;329-337.
12. Bartels F., Morris J.W. Jr., Dalke G., Gust W. J. Electr. Mater. 23:1994;787-790.
13. S.P. Sangha, D.M. Jacobson, A.T. Peacock, Welding Res. Suppl., October 1998, pp. 432-438.