Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 891-898

  Song, Fubin ^a   Lee, S W Ricky ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; DISSOLUTION; INTERMETALLICS; MICROELECTRONICS; RELIABILITY THEORY; TIN ALLOYS;

CYCLIC BENDING; GALVANIC CORROSION; MICROELECTRONICS INDUSTRY; SOLDER MATRIX;

SOLDERED JOINTS;

EID: 33845584525     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645761     Document Type: Conference Paper

References (12)

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