Effect of corrosion on the low cycle fatigue behavior of Sn-4.0Ag-0.5Cu lead-free solder joints

International Journal of Fatigue

Volumn 30, Issue 5, 2008, Pages 917-930

  Andersson, C ^a   Liu, J ^a,b  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHANGHAI UNIVERSITY   (China)

Author keywords

Corrosion; Lead free; Low cycle fatigue; Solder

Indexed keywords

CORROSION; PLASTIC DEFORMATION; SOLDERED JOINTS; SOLUTIONS; TEMPERATURE CONTROL;

FACTORIAL DESIGN; LOW CYCLE FATIGUE; PLASTIC STRAIN RANGE; SALT SOLUTIONS;

FATIGUE OF MATERIALS;

EID: 38949147384     PISSN: 01421123     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijfatigue.2007.06.009     Document Type: Article

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