In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints

Materials Science and Engineering: A

Volumn 528, Issue 6, 2011, Pages 2686-2693

  Zhang, Q K ^a   Zhang, Z F ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Creep fatigue; Fracture; Grain boundary sliding; In situ observation; Shear; Sn 58Bi solder

Indexed keywords

BINARY ALLOYS; BISMUTH ALLOYS; COPPER ALLOYS; CREEP; CREEP RESISTANCE; GRAIN BOUNDARY SLIDING; LEAD-FREE SOLDERS; SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; STRAIN HARDENING; STRAIN RATE;

CREEP FATIGUE; DEFORMATION AND FRACTURE; FATIGUE FRACTURE BEHAVIOR; FATIGUE-RESISTANCE; GRAIN BOUNDARIES SLIDING; IN-SITU OBSERVATIONS; SHEAR; SHEAR FATIGUES; SN-58BI SOLDER; SOLDER JOINTS;

FRACTURE;

EID: 79151483909     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.12.041     Document Type: Article

References (28)

1. Abtew M., Selvaduray G. Mater. Sci. Eng. R 2000, 27:95-141.
2. Shohji I., Yoshida T., Takahashi T., Hioki S. J. Mater. Sci.: Mater. Electron 2004, 15:219-223.
3. Morris J.W., Goldstein J.L.F., Mei Z. J. Electron. Mater. 1993, 22:25-27.
4. Zeng K., Tu K.N. Mater. Sci. Eng. R 2002, 38:55-105.
5. Mei Z., Morris J.W. J. Electron. Mater. 1992, 21:599-607.
6. Miao H.W., Duh J.G. Mater. Chem. Phys. 2001, 71:255-271.
7. Sandnes E., Williams M.E., Vaudin M.D., Stafford G.R. J. Electron. Mater. 2008, 37:490-497.
8. Tai F., Guo F., Han M.T., Xia Z.D., Lei Y.P., Shi Y.W. Mater. Sci. Eng. A 2010, 527:3335-3342.
9. Laurila T., Vuorinen V., Kivilahti J.K. Mater. Sci. Eng. R 2005, 49:1-60.
10. Tu K.N., Zeng K. Mater. Sci. Eng. R 2001, 34:1-580.
11. Takemoto T., Matsunawa A., Takahashi M. J. Mater. Sci. 1997, 32:4077-4084.
12. Wei M.X., Yao W.S., Yong P.L., Zhi D.X., Fu G. J. Electron. Mater. 2008, 37:1751-1755.
13. Sun Y., Liang J., Xu Z.H., Wang G.F., Li X.D. J. Electron. Mater. 2009, 38:400-409.
14. Ding Y., Wang C.Q., Tian Y.H., Li M.Y. J. Alloys Compd. 2007, 428:274-285.
15. Park S., Dhakal R., Lehman L., Cotts E. Acta Mater. 2007, 55:3253-3260.
16. Kanchanomai C., Miyashita Y., Mutoh Y., Mannan S.L. Mater. Sci. Eng. A 2003, 345:90-98.
17. Matin M.A., Vellinga W.P., Geers M.G.D. Mater. Sci. Eng. A 2006, 431:166-174.
18. Mahmudi R., Geranmayeh A.R., Mahmoodi S.R., Khalatbari A. J. Mater. Sci.: Mater. Electron. 2007, 18:1071-1078.
19. Dutta I. J. Electron. Mater. 2003, 33:201-207.
20. Telang A.U., Bieler T.R., Crimp M.A. Mater. Sci. Eng. A 2006, 421:22-34.
21. Mavoori H., Chin J., Vayman S., Moran B., Keer L., Fine M. J. Electron. Mater. 1997, 26:783-790.
22. Evans J.W. A Guide to Lead-free Solders 2007, Springer, London, 128-143.
23. Sherby O.D., Taleff E.M. Mater. Sci. Eng. A 2002, 322:89-99.
24. Nabarro F.R.N. Acta Mater. 2006, 54:263-295.
25. Padmanabhan K.A. J. Mater. Sci. 2009, 44:2226-2238.
26. Abd El-Rehim A.F. J. Mater. Sci. 2008, 43:1444-1450.
27. Kim K.S., Huh S.H., Suganuma K. Mater. Sci. Eng. A 2002, 333:106-114.
28. Zhang Q.K., Zhu Q.S., Zou H.F., Zhang Z.F. Mater. Sci. Eng. A 2010, 527:1367-1376.