Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution

Corrosion Science

Volumn 53, Issue 10, 2011, Pages 3331-3336

  Yokoyama, Ken'ichi ^a   Tsuji, Daisuke ^a   Sakai, Jun'ichi ^b  

^a KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

^b WASEDA UNIVERSITY   (Japan)

Author keywords

A. Electronic materials; A. Tin; B. SEM; C. Intergranular corrosion; C. Stress corrosion

Indexed keywords

A. TIN; B. SEM; C. STRESS CORROSION; ELECTRONIC MATERIALS; INTERGRANULAR CORROSION;

ALLOYS; COPPER ALLOYS; CRACKS; DISSOLUTION; FRACTURE; SILVER ALLOYS; SODIUM CHLORIDE; SOLDERED JOINTS; SOLDERING ALLOYS; STRESS CORROSION CRACKING; TIN ALLOYS;

TIN;

EID: 79960713274     PISSN: 0010938X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.corsci.2011.06.010     Document Type: Article

References (17)

1. Abtew M., Selvaduray G. Lead-free solders in microelectronics. Mater. Sci. Eng., R 2000, 27:95-141.
2. Suganuma K. Advances in lead-free electronics soldering. Curr. Opin. Solid State Mater. Sci. 2001, 5:55-64.
3. Li Y., Wong C.P. Recent advances of conductive adhesive as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Mater. Sci. Eng., R 2006, 51:1-35.
4. Anderson I.E. Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications. J. Mater. Sci. - Mater. Electron. 2007, 18:55-76.
5. Ma H., Suhling J.C. A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. 2009, 44:1141-1158.
6. Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Off. J. Eur. Union (2003) L37/19-L37/23.
7. Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on Waste Electrical and Electronic Equipment (WEEE). Off. J. Eur. Union (2003) L37/24-L37/38.
8. Montesperelli G., Rapone M., Nanni F., Travaglia P., Riani P., Marazza R., Gusmano G. Electrochemical and mechanical behavior of Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn solders. Mater. Corros. 2008, 59:662-669.
9. Li D., Conway P.P., Liu C. Corrosion characterization of tin-lead and lead free solders in 3.5wt.% NaCl solution. Corros. Sci. 2008, 50:995-1004.
10. Lin C.K., Chu D.Y. Creep rupture of lead-free Sn-3.5Ag and Sn-3.5Ag-0.5Cu solders. J. Mater. Sci. - Mater. Electron. 2005, 16:355-365.
11. Wade N., Wu K., Kunii J., Yamada S., Miyahara K. Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys. J. Electron. Mater. 2001, 30:1228-1231.
12. Joo D.K., Yu J., Shin S.W. Creep rupture of lead-free Sn-3.5Ag-Cu solders. J. Electron. Mater. 2003, 32:541-547.
13. Sun Y., Liang J., Xu Z.H., Wang G., Li X. In situ observation of small-scale deformation in a lead-free solder alloy. J. Electron. Mater. 2009, 38:400-409.
14. Chang T.C., Hon M.H., Wang M.C., Lin D.Y. Electrochemical behaviors of the Sn-9Zn-xAg lead-free solders in a 3.5wt% NaCl solution. J. Electrochem. Soc. 2004, 151:C484-C491.
15. Mohanty U.S., Lin K.L. Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-xGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution. Corros. Sci. 2008, 50:2437-2443.
16. Rosalbino F., Angelini E., Zanicchi G., Carlini R., Marazza R. Electrochemical corrosion study of Sn-3Ag-3Cu solder alloy in NaCl solution. Electrochim. Acta 2009, 54:7231-7235.
17. Wu B.Y., Chan Y.C., Alam M.O. Electrochemical corrosion study of Pb-free solders. J. Mater. Res. 2006, 21:62-70.