In situ observation of small-Scale deformation in a lead-free solder alloy

Journal of Electronic Materials

Volumn 38, Issue 3, 2009, Pages 400-409

  Sun, Yong ^a   Liang, Jin ^b   Xu, Zhi Hui ^a   Wang, Guofeng ^c   Li, Xiaodong ^a  

^a UNIVERSITY OF SOUTH CAROLINA   (United States)

^b India Center of Excellence   (United States)

^c Indiana University Purdue University Indianapolis   (United States)

Author keywords

Deformation mechanisms; Grain boundary decohesion; Grain boundary sliding; SAC alloy; Slip bands

Indexed keywords

ATOMIC-FORCE MICROSCOPIES; DEFORMATION BEHAVIORS; DEFORMATION MECHANISMS; DENDRITIC MICROSTRUCTURES; DOMINANT MECHANISMS; GRAIN BOUNDARY DECOHESION; IN-SITU OBSERVATIONS; INTRAGRANULAR SLIPS; LARGE STRAINS; LEAD-FREE SOLDER ALLOYS; LOCAL STRAINS; MICRO-STRUCTURAL; ROOM TEMPERATURES; SAC ALLOY; SLIP BANDS; SMALL STRAINS; SN-AG-CU;

ALLOYS; CERIUM ALLOYS; COPPER; DEFORMATION; DENDRIMERS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; LEAD; MECHANICAL PROPERTIES; MECHANICAL TESTING; MECHANISMS; OPTICAL MICROSCOPY; SILVER; SOLDERING ALLOYS; STRAIN RATE; TIN;

GRAIN BOUNDARY SLIDING;

EID: 59849099827     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0600-7     Document Type: Article

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