Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate

Journal of Alloys and Compounds

Volumn 545, Issue , 2012, Pages 70-79

  Li, J F ^a   Agyakwa, P A ^a   Johnson, C M ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

Intermetallics; Kinetics; Liquid solid reactions; Microstructure; Scanning electron microscopy (SEM); Surfaces and interfaces

Indexed keywords

CU SUBSTRATE; FORMING GAS; INTERMETALLIC COMPOUND LAYER; LIQUID-SOLID REACTION; SN-BASED SOLDERS; SURFACES AND INTERFACES;

ALUMINUM; ENZYME KINETICS; INTERMETALLICS; MICROSTRUCTURE; PHASE INTERFACES; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS;

TIN;

EID: 84866093727     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2012.08.023     Document Type: Article

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