Metallurgy and kinetics of liquid-solid interfacial reaction during lead-free soldering

Materials Transactions

Volumn 47, Issue 2, 2006, Pages 317-325

  Liang, Jin ^a   Dariavach, Nader ^a   Callahan, Paul ^a   Shangguan, Dongkai ^b  

^a Root cause Analysis Network Management Design and Development   (United States)

^b FLEXTRONICS INTERNATIONAL   (United States)

Author keywords

Intermetallic kinetics; Lead free; Pcb board finish; Wettability

Indexed keywords

EUTECTICS; INTERMETALLICS; METALLURGY; PRINTED CIRCUIT BOARDS; REACTION KINETICS; SURFACE TENSION;

INTERMETALLIC KINETICS; LEAD-FREE; PCB BOARD FINISH; WETTABILITY;

SOLDERING;

EID: 33645778964     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.47.317     Document Type: Article

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