SCOPUS 정보 검색 플랫폼

Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 1, 2012, Pages 14-21

Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints

(3) Wu, Cuiping a Shen, Jun a Peng, Changfei a

a CHONGQING UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION EFFECT; CALORIMETRIC TEST; IMC LAYER; MELTING PROPERTIES; MICROSTRUCTURAL OBSERVATIONS; RE ADDITIONS; RE ELEMENTS; SOLDER ALLOYS; SOLDER JOINTS; SOLIDUS TEMPERATURE; TEMPERATURE ZONE; TRACE AMOUNTS;

ADSORPTION; BISMUTH; BISMUTH COMPOUNDS; MICROSTRUCTURE; RARE EARTH ADDITIONS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 84856962912 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-011-0383-0 Document Type: Article

Times cited : (25)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.