SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 40, Issue 9, 2011, Pages 1956-1961

Reaction of liquid Sn-Ag-Cu-Ce solders with solid copper

(4) Chriastel'Ova J a Rizekova Trnkova L a Pociskova Dimova K a Ozvold M a

a SLOVAK UNIVERSITY OF TECHNOLOGY (Slovakia)

Author keywords

intermetallics; Lead free solders; microstructure; rare earth Ce; Sn Ag Cu alloys

Indexed keywords

CE ADDITION; CE CONTENTS; CU SUBSTRATE; DIPPING TIME; EUTECTIC ALLOYS; EUTECTIC SOLDERS; IMC LAYER; LEAD FREE SOLDERS; LEAD-FREE; LIQUID SOLDERS; MELTING TEMPERATURES; SN-3.5AG; SN-AG-CU ALLOYS; SNAGCU SOLDER; SOLDER INTERFACES;

CERIUM; COPPER ALLOYS; EUTECTICS; INTERMETALLICS; LIQUIDS; MELTING POINT; MICROSTRUCTURE; MORPHOLOGY; PHASE INTERFACES; PHASE TRANSITIONS; SHELLFISH; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 80051579317 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-011-1700-3 Document Type: Article

Times cited : (6)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.