Liquid and solid state interfacial reactions of Sn-Ag-Cu and Sn-In-Ag-Cu solders with Ni-P under bump metallization

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 431-435

  Sharif, Ahmed ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Dissolution; Inter metallic compound; Lead free solder; SEM

Indexed keywords

DISSOLUTION; HEAT TREATMENT; INTERMETALLICS; LEAD; NICKEL ALLOYS; SCANNING ELECTRON MICROSCOPY;

BALL-GRID-ARRAY (BGA); LEAD-FREE SOLDER; SOLID STATE AGING;

TIN ALLOYS;

EID: 33644916637     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.061     Document Type: Conference Paper

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