Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-Plated Kovar substrates

Journal of Electronic Materials

Volumn 34, Issue 3, 2005, Pages 299-310

  Lopez, Edwin P ^a   Vianco, Paul T ^b   Rejent, Jerome A ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Cu substrates; Kovar substrates; Pb free solders; Sn ag xcu

Indexed keywords

COPPER ALLOYS; ELECTRONICS INDUSTRY; LEAD ALLOYS; NICKEL ALLOYS; SILVER ALLOYS; SOLDERING; SUBSTRATES; SURFACE TENSION; TIN ALLOYS; WETTING;

CU SUBSTRATES; KOVAR SUBSTRATES; PB-FREE SOLDERS; SN-AG-XCU;

SOLDERING ALLOYS;

EID: 17144404557     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0217-z     Document Type: Article

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