Determination of an effective coefficient of thermal expansion of electronic packaging components: A whole-field approach

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 2, 1996, Pages 240-247

  Han, Bongtae ^a   Guo, Yifan ^a  

^a IBM   (United States)

Author keywords

Coefficient of thermal expansion (CTE); Electronic packaging component; Moir interferometry; Plastic ball grid array package; Stacked memory cube; Thin small outline package

Indexed keywords

ALUMINUM ALLOYS; INTERFEROMETRY; SPATIAL VARIABLES MEASUREMENT; TEMPERATURE; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION; ELECTRONIC PACKAGING COMPONENTS; MOIRE INTERFEROMETRY; PLASTIC BALL GRID ARRAY; STACKED MEMORY CUBE; THIN SMALL OUTLINE PACKAGES; WHOLE FIELD DISPLACEMENT MEASUREMENT;

ELECTRONICS PACKAGING;

EID: 0030166119     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.506110     Document Type: Article

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