Experimental wettability study of lead-free solder on Cu substrates using varying flux and temperature

Journal of Electronic Materials

Volumn 37, Issue 1, 2008, Pages 125-133

  Xu, Dong Xia ^a   Lei, Yong Ping ^a   Xia, Zhi Dong ^a   Guo, Fu ^a   Shi, Yao Wu ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Lead free solder; Soldering flux; Surface insulation resistance (SIR); Wettability

Indexed keywords

LEAD-FREE SOLDER; SOLDERING FLUX; SURFACE INSULATION RESISTANCE (SIR); WATER-SOLUBLE FLUX (WSF);

INSULATION; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THERMAL EFFECTS; WETTING;

SOLDERING ALLOYS;

EID: 37249073931     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0304-4     Document Type: Article

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