In-situ study on growth behavior of Ag3Sn in Sn-3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

Journal of Alloys and Compounds

Volumn 537, Issue , 2012, Pages 286-290

  Ma, H T ^a   Qu, L ^a   Huang, M L ^a   Gu, L Y ^a   Zhao, N ^a   Wang, L ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Competitive growth; Crystal structure; Intermetallic compounds; Synchrotron radiation

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; CRYSTAL STRUCTURE; INDIUM ALLOYS; INTERMETALLICS; LEAD-FREE SOLDERS; SILVER ALLOYS; SOLDERING; SOLIDIFICATION; SYNCHROTRON RADIATION; SYNCHROTRONS;

COMPETITIVE GROWTH; GROWTH BEHAVIOR; GROWTH PATTERNS; GROWTH VELOCITY; IN-SITU STUDY; REALTIME IMAGING; SOLDERING REACTIONS; SOLIDIFICATION PROCESS;

TIN ALLOYS;

EID: 84863003817     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2012.05.055     Document Type: Letter

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