Wetting of microcrystalline and nanocrystalline Ni substrates by molten Sn-3.5Ag-0.7Cu alloy

Materials Letters

Volumn 64, Issue 22, 2010, Pages 2454-2457

  Yang, Jun ^a   Shen, Ping ^a   Yin, Zhongfa ^a   Sun, Jianxin ^a   Jiang, Qichuan ^a  

^a JILIN UNIVERSITY   (China)

Author keywords

Diffusion; Interface; Nanocrystalline materials; Wetting

Indexed keywords

CU ALLOY; DIFFUSIVITIES; ENHANCED DIFFUSION; INTERFACE; INTERFACIAL REACTIVITY; INTERMETALLIC COMPOUNDS; MODIFIED SESSILE DROP METHOD; NANOCRYSTALLINE NI; NANOCRYSTALLINE SUBSTRATES; NANOCRYSTALLINES; NANOMETER GRAINS; NI ATOMS; NI SUBSTRATES; REACTION LAYERS; REGIONAL DISTRIBUTION; SN-3.5AG; TRIPLE LINES; WETTING BEHAVIOR;

CERIUM ALLOYS; DIFFUSION; DROPS; NANOCRYSTALLINE MATERIALS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SUBSTRATES; TIN; WETTING;

NANOCRYSTALLINE ALLOYS;

EID: 77956252358     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2010.08.017     Document Type: Article

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