IMC growth in solid-liquid interdifussion bonds

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

  Ladani, Leila J ^a   Razmi, Jafar ^a  

^a Utah State University   (United States)

Author keywords

3D ICs; Bond; Intermetallics; Solder

Indexed keywords

10 MICRON; 3D ICS; BONDING TECHNIQUES; BONDING TIME; COPPER DIFFUSION; HIGH DENSITY; HIGH-TEMPERATURE MELTING; INTER-DIFFUSION; LOW MELTING TEMPERATURES; NEW TECHNOLOGIES; PHASE LAGS; PROCESS PARAMETERS; SEM; SOLID-LIQUID;

ELECTRONICS ENGINEERING; INTERMETALLICS; LIQUIDS; WAVELET TRANSFORMS;

THREE DIMENSIONAL;

EID: 77955205792     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501313     Document Type: Conference Paper

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