Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections

Microsystem Technologies

Volumn 15, Issue 1 SPEC. ISS., 2009, Pages 101-107

  Huang, Zhiheng ^a,b   Conway, Paul P ^a   Qin, Rongshan ^c  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b MAX PLANCK INSTITUT FÜR EISENFORSCHUNG GMBH   (Germany)

^c Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BIOACTIVITY; BRAZING; GROWTH KINETICS; INTERMETALLICS; LEAD COMPOUNDS; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SOLDERING; SOLDERING ALLOYS; THERMODYNAMICS; WELDING;

BASE METALS; BOUNDARY TRACKING; EXPERIMENTAL DATUM; FICK'S DIFFUSION EQUATIONS; GEOMETRICAL FEATURES; INTERFACIAL INTERMETALLICS; INTERMETALLIC COMPOUNDS; KINETIC MODELS; LEAD-FREE; LEAD-FREE SOLDERS; MECHANICAL PERFORMANCES; MODELING; MODELING TECHNIQUES; ONE DIMENSIONS; PARABOLIC GROWTHS; PHASE FIELD MODELS; POSSIBLE SOLUTIONS; SERVICE ENVIRONMENTS; SOLDER JOINTS; SOLDERING PROCESSES; THERMODYNAMIC PARAMETERS; ULTRAFINE;

LEAD;

EID: 54049158913     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0629-9     Document Type: Conference Paper

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