Solid state interfacial reactions in electrodeposited Cu/Sn couples

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 20, Issue 1, 2010, Pages 90-96

  TANG, Wen ming ^a   HE, An qiang ^b   LIU, Qi ^b   IVEY, D G ^b  

^a HEFEI UNIVERSITY OF TECHNOLOGY   (China)

^b UNIVERSITY OF ALBERTA   (Canada)

Author keywords

Cu Sn couple; electrodeposition; growth kinetics; microstructure; solid state reaction

Indexed keywords

CU/SN COUPLE; ELECTRODEPOSITION GROWTH; INTERFACIAL REACTIONS; INTERMEDIATE PHASIS; MATRIX; PARABOLIC GROWTH; ROOM TEMPERATURE; SI WAFER;

ACTIVATION ENERGY; ANNEALING; BIOACTIVITY; ELECTRODEPOSITION; GROWTH KINETICS; MICROSTRUCTURE; PHASE INTERFACES; REACTION KINETICS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SOLID STATE REACTIONS;

TIN;

EID: 76049094966     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(09)60102-3     Document Type: Article

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