Interfacial interaction of solid nickel with liquid Pb-free Sn-Bi-In-Zn-Sb soldering alloys

Journal of Alloys and Compounds

Volumn 460, Issue 1-2, 2008, Pages 337-352

  Dybkov, V I ^a   Khoruzha, V G ^a   Sidorko, V R ^a   Meleshevich, K A ^a   Samelyuk, A V ^a   Berry, D C ^b   Barmak, K ^b  

^a FRANTSEVICH INSTITUTE FOR PROBLEMS OF MATERIALS SCIENCE   (Ukraine)

^b CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

Dissolution kinetics; Ni3Sn4 layer growth rate; Nickel; Nickel to solder joint strength; Pb free soldering alloys

Indexed keywords

ARRHENIUS PLOTS; DISSOLUTION; INTERFACES (MATERIALS); NICKEL; RATE CONSTANTS; SOLUBILITY;

DISSOLUTION KINETICS; DISSOLUTION RATE; NICKEL TO SOLDER JOINT STRENGTH;

SOLDERING ALLOYS;

EID: 44449143379     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.06.056     Document Type: Article

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